IP Library › Granted Patent US 9,327,369
Granted Patent B2
US 9,327,369 · App. 14/205,289 · Granted May 3, 2016

Method of manufacturing thermal module with enhanced assembling structure

Inventors: Sheng-Huang Lin (New Taipei, TW); Kuo-Sheng Lin (New Taipei, TW)
Assignee: Asia Vital Components Co., Ltd.
B23P15/26F28D1/00H01L23/00B23P2700/10Y10T29/4935
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Quick Facts
Patent No.
US 9,327,369
App. No.
14/205,289
Granted
May 3, 2016
Kind
B2
Abstract

A thermal module with enhanced assembling structure includes a base and a heat pipe. The base is formed on a middle portion with a longitudinal receiving recess, which has two end portions forming two supporting portions and a middle portion formed into an opening. A first and a second extended arm are formed at junctions between the receiving recess and two longitudinal sides of the opening. Wall surfaces of the first and second extended arms adjacent to the longitudinal sides of the opening are formed with alternating elevated and sunken areas. The heat pipe is held down in the receiving recess by the first and second extended arms to fitly engage with the elevated and sunken areas. Therefore, there is an increased fitting tightness between the heat pipe and the base to ensure enhanced assembling strength of the thermal module and reduce the manufacturing cost thereof.

Claims (9)

1. A method of manufacturing a thermal module with enhanced assembling structure, comprising the following steps:

providing a base and a heat pipe, and defining a top and a bottom of the base as a first side and a second side, respectively;

performing a mechanical processing from the first side toward the second side to form a receiving recess on the base, such that the receiving recess having two end portions respectively forming a supporting portion and a middle portion formed into an opening located between the two supporting portions and communicating the first side with the second side;

performing a mechanical processing from the second side toward the first side by applying a force to bend junctions between the receiving recess and two longitudinal sides of the opening, so as to form a first extended arm and a second extended arm, and two wall surfaces being located between the two longitudinal sides of the opening and the first and the second extended arms, respectively;

performing a mechanical processing from the first side toward the second side by applying a force to positions of the first and second extended arms adjacent to the longitudinal sides of the opening, so as to form two rows of alternating elevated and sunken areas on the wall surfaces; and

setting the heat pipe in the receiving recess on the base, and applying a force to the first and second extended arms for them to press against and hold down the heat pipe in the receiving recess.

2. The method of manufacturing a thermal module with enhanced assembling structure as claimed in claim 1 , wherein each mechanical processing is stamping.

3. The method of manufacturing a thermal module with enhanced assembling structure as claimed in claim 2 , wherein the heat pipe is tightly fitted in the receiving recess through a further mechanical processing.

4. The method of manufacturing a thermal module with enhanced assembling structure as claimed in claim 3 , wherein the further mechanical processing is stamping.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 11, 2014
From: LIN, SHENG-HUANG; LIN, KUO-SHENG
To: ASIA VITAL COMPONENTS CO., LTD.
Reel/Frame 032409/0688 →
Continuity (1)
Related Publication 20150258643A1 · Sep 17, 2015