Electronic device with temperature detecting element
In an electronic device, a heat generation part pattern is connected to a heat generating element to heat from the heat generating element. A temperature detecting element is disposed adjacent to a first surface of a substrate. A direct under layer pattern is disposed on a second surface of the substrate opposite to the temperature detecting element in an area including a portion corresponding to the temperature detecting element. An interlayer connection pillar connects between the heat generation part pattern and the direct under layer pattern to conduct heat. The heat generated from the heat generating element is effectively conducted to the temperature detecting element through the heat generation part pattern, the interlayer connection pillar, and the direct under layer pattern, and thus the temperature detecting element accurately detects the temperature of the heat generating element.
1. An electronic device comprising:
a multi-layer board having a plurality of substrates in layers, the plurality of substrates including a first substrate and a second substrate;
a heat generation part pattern being disposed on a surface of the second substrate;
a heat generating element generating heat, the heat generating element being disposed on the heat generation part pattern to conduct the heat to the heat generation part pattern;
a temperature detecting element being disposed adjacent to a first surface of the first substrate and detecting a temperature of the heat generating element;
a direct under layer pattern disposed on a second surface of the first substrate opposite to the temperature detecting element and in an area including a portion corresponding to the temperature detecting element, the direct under layer pattern being in a layer different from the heat generation part pattern;
an interlayer connection pillar connecting between the heat generation part pattern and the direct under layer pattern to conduct the heat from the heat generation part pattern to the direct under layer pattern; and
a heat collecting pattern being disposed on the first surface of the first substrate and connected to the temperature detecting element, the heat collecting pattern having a width greater than a width of the temperature detecting element and being opposed to the direct under layer pattern through the first substrate.
2. The electronic device according to claim 1 , wherein
the temperature detecting element has a first contact and a second contact,
the temperature detecting element senses a voltage between the first contact and the second contact to detect the temperature,
the heat collecting pattern includes a first heat collecting pattern being on a high potential side and a second heat collecting pattern being on a low potential side,
the first contact is connected to a detection power source through the first heat collecting pattern, and
the second contact is connected to a ground through the second heat collecting pattern.
3. The electronic device according to claim 2 , wherein
a connecting portion connecting between the second heat collecting pattern and the ground has a width smaller than a width of the second heat collecting pattern.
4. The electronic device according to claim 1 , wherein
the temperature detecting element is disposed between the first heat collecting pattern and the second heat collecting pattern, and
at least one of the first heat collecting pattern and the second heat collecting pattern has an outline including a curve that is outwardly convex at least in one direction away from the temperature detecting element.
5. The electronic device according to claim 1 , further comprising
a mounting surface on a side opposite to the temperature detecting element, wherein
the heat generating element is a semiconductor switching element having a lead part,
the heat generating element is mounted on the mounting surface such that the lead part faces the mounting surface, and
the heat generating element is disposed to radiate heat to a heat sink through a rear surface opposite to the lead part.
6. The electronic device according to claim 1 , wherein the interlayer connection pillar connects the heat generation part pattern and the first substrate.