Lamination substrate and manufacturing method of the same
A manufacturing method according to an embodiment of the present invention includes: a step of forming a tapered first groove on a surface of a semiconductor wafer; a step of forming a notch groove having a narrow width in a bottom portion of the first groove; a step of laminating the semiconductor wafer to a mother glass substrate using a sealing material; a step of forming a tapered second groove on a back surface of the semiconductor wafer; a step of separating a semiconductor substrate of the semiconductor wafer by cutting the semiconductor wafer from the second groove toward the notch groove; and a step of separating respective counter substrates by cutting the mother glass substrate along a scribe groove.
1. A manufacturing method for manufacturing a lamination substrate in which a first substrate part and a second substrate part are laminated together using a first mother substrate including a plurality of first substrate parts and a second mother substrate including a plurality of second substrate parts, the manufacturing method comprising:
a step of forming the first substrate part including a terminal in the first mother substrate;
a step of forming a tapered first groove on a first surface provided with the terminal of the first mother substrate;
a step of forming a notch groove having a width narrower than the maximum width of the first groove in a bottom portion of the first groove;
a step of providing an adhesive in at least one of the first substrate part and the second substrate part;
a step of laminating the first mother substrate to the second mother substrate using the adhesive such that the first surface is disposed on a side of the second mother substrate and the terminal is disposed outside the adhesive;
a step of forming a tapered second groove at a position corresponding to the first groove on a second surface opposite to the first surface of the first mother substrate;
a step of separating the respective first substrate parts by cutting the first mother substrate from the second groove toward the notch groove;
a step of providing a scribe groove on a surface of the second mother substrate not facing the first substrate part; and
a step of separating the respective second substrate parts by cutting the second mother substrate along the scribe groove, wherein a depth of the first groove in a thickness direction of the first substrate part is different from a depth of the second groove in the thickness direction of the first substrate part, and the depth of the first groove is deeper than the depth of the second groove.
2. A lamination substrate comprising:
a first substrate;
a second substrate disposed to face a first surface of the first substrate;
an adhesive disposed between the first substrate and the second substrate to laminate the first substrate and the second substrate together; and
a terminal formed on a side of the first surface of the first substrate and disposed outside the adhesive,
wherein a side end surface of the first substrate includes:
a first chamfered portion provided on the side of the first surface;
a second chamfered portion provided on the side of a second surface opposite to the first surface and having a depth in a thickness direction of the first substrate different from that of the first chamfered portion; and
a cut surface disposed between the first chamfered portion and the second chamfered portion,
a length of the first substrate in a direction perpendicular to the thickness direction is the same as that of the second substrate, and
a side end of the second substrate is disposed between the terminal and the adhesive closer to the terminal, wherein
the first substrate and the second substrate have a same length respectively in the direction perpendicular to the thickness direction,
the side end of the second substrate is disposed between the terminal and the adhesive closer to the terminal, and
the depth of the first chamfered portion in the thickness direction of the first substrate is larger than the depth of the second chamfered portion in the thickness direction of the first substrate.