IP Library › Granted Patent US 9,333,736
Granted Patent B2
US 9,333,736 · App. 14/468,662 · Granted May 10, 2016

Processing apparatus and processing method of stack

Inventors: Kayo Kumakura (Tochigi, JP); Tomoya Aoyama (Atsugi, JP); Akihiro Chida (Isehara, JP); Kohei Yokoyama (Fujisawa, JP); Masakatsu Ohno (Tochigi, JP); Satoru Idojiri (Tochigi, JP); Hisao Ikeda (Zama, JP); Hiroki Adachi (Tochigi, JP); Yoshiharu Hirakata (Ebina, JP); Shingo Eguchi (Atsugi, JP); Yasuhiro Jinbo (Isehara, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
B32B43/006B26D1/04G02B6/00H01L21/67092B26D2001/006B32B38/10H01L2221/68327Y10T156/1126Y10T156/1132Y10T156/1168Y10T156/1184Y10T156/1933Y10T156/1944Y10T156/1961Y10T156/1967
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Quick Facts
Patent No.
US 9,333,736
App. No.
14/468,662
Granted
May 10, 2016
Kind
B2
Abstract

A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.

Claims (53)

1. A processing apparatus of a stack including two substrates attached to each other with a gap provided between and at an end portion of the two substrates comprising:

a fixing mechanism configured to fix to part of the stack;

a plurality of adsorption jigs configured to fix to an outer peripheral edge of one of the substrates of the stack;

a plurality of clamp jigs configured to fix to part of a top surface and a bottom surface of a flexible substrate of the stack; and

a wedge-shaped jig configured to be inserted into a corner of the stack,

wherein the plurality of adsorption jigs include a mechanism that allows the plurality of adsorption jigs to move separately in a vertical direction and a horizontal direction.

2. The processing apparatus according to claim 1 , further comprising a sensor configured to sense a position of the gap.

3. The processing apparatus according to claim 1 ,

wherein a tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack, and

wherein the wedge-shaped jig is inserted into the gap.

4. The processing apparatus according to claim 1 , further comprising a nozzle configured to inject liquid to the stack.

5. The processing apparatus according to claim 1 , further comprising a roller configured to be in contact with the one of the substrates of the stack.

6. A processing apparatus of a stack including a flexible substrate comprising:

a fixing mechanism configured to fix to part of the stack;

a plurality of adsorption jigs configured to fix to an outer peripheral edge of the flexible substrate of the stack; and

a plurality of clamp jigs configured to fix to part of a top surface and a bottom surface of the flexible substrate of the stack,

wherein the plurality of adsorption jigs and the plurality of clamp jigs each include a mechanism that allows the plurality of adsorption jigs or the plurality of clamp jigs to move separately in a vertical direction and a horizontal direction.

7. The processing apparatus according to claim 6 , further comprising a nozzle configured to inject liquid to the stack.

8. The processing apparatus according to claim 6 ,

wherein the plurality of clamp jigs include a first clamp jig and a second clamp jig.

9. The processing apparatus according to claim 1 ,

wherein the stack is a first stack, and

wherein the fixing mechanism, the plurality of adsorption jigs, and the wedge-shaped jig are included in a separating unit,

the processing apparatus further comprising:

a loader unit configured to feed the first stack;

a support feeding unit configured to feed a support;

the separating unit configured to separate one of the substrates of the first stack to form a remaining portion;

an attaching unit configured to attach the support to the remaining portion with the use of an adhesive layer; and

an unloader unit configured to transport a second stack including the remaining portion and the support attached to each other with the adhesive layer.

10. The processing apparatus according to claim 1 ,

wherein the stack is a first stack, and

wherein the fixing mechanism, the plurality of adsorption jigs, and the wedge-shaped jig are included in a first separating unit,

the processing apparatus further comprising:

a first loader unit configured to feed the first stack;

a support feeding unit configured to feed a first support and a second support;

the first separating unit configured to separate one of the substrates of the first stack to form a first remaining portion;

a first attaching unit configured to attach the first support to the first remaining portion with the use of a first adhesive layer;

a first unloader unit configured to transport a second stack including the first remaining portion and the first support attached to each other with the first adhesive layer;

a second loader unit configured to feed the second stack;

a second separating unit configured to separate other of the substrates of the second stack to form a second remaining portion;

a second attaching unit configured to attach the second support to the second remaining portion with the use of a second adhesive layer; and

a second unloader unit configured to transport a third stack including the second remaining portion and the second support attached to each other with the second adhesive layer,

wherein the second separating unit comprises:

a fixing mechanism configured to fix to the other of the substrates of the second stack;

a plurality of adsorption jigs configured to fix to an outer peripheral edge of the first support of the second stack; and

a plurality of clamp jigs configured to fix to part of the first support of the second stack, and

wherein the plurality of adsorption jigs and the plurality of clamp jigs each include a mechanism that allows the plurality of adsorption jigs or the plurality of clamp jigs to move separately in a vertical direction and a horizontal direction.

11. A method for processing a stack including a flexible substrate comprising the steps of:

fixing part of the stack to a fixing mechanism;

moving a plurality of adsorption jigs to fix to an outer peripheral edge of the flexible substrate of the stack with the plurality of adsorption jigs;

moving some of the adsorption jigs to separate part of the flexible substrate of the stack;

fixing a plurality of clamp jigs to part of a separated region; and

moving the adsorption jigs and the clamp jigs to carry on separation of the flexible substrate of the stack.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 8, 2014
From: KUMAKURA, KAYO; AOYAMA, TOMOYA; CHIDA, AKIHIRO; YOKOYAMA, KOHEI; OHNO, MASAKATSU; IDOJIRI, SATORU; IKEDA, HISAO; ADACHI, HIROKI; HIRAKATA, YOSHIHARU; EGUCHI, SHINGO; JINBO, YASUHIRO
To: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Reel/Frame 033909/0129 →
Priority Claims (4)
JP 2013-179217 · Aug 30, 2013 · national
JP 2013-179220 · Aug 30, 2013 · national
JP 2014-029422 · Feb 19, 2014 · national
JP 2014-029423 · Feb 19, 2014 · national
Continuity (1)
Related Publication 20150059987A1 · Mar 5, 2015