Ceramic board, method manufacturing thereof, image sensor package and method of manufacturing the same
Disclosed herein is a ceramic board and the manufacturing method and an image sensor package and a manufacturing method thereof, the ceramic board including a ceramic body in which an upper surface is formed with a first groove, a second groove is formed in the first groove, and the second groove is formed with a through hole; a first electrode pad formed in the first groove; and a second electrode pad formed at any one of the upper surface, a lower surface and the both surfaces of the ceramic body, electrically connected to the first electrode pad.
1. A ceramic board, comprising:
a ceramic body having a first groove depressed from an upper surface of the ceramic body and a second groove depressed from a bottom surface of the first groove, wherein the first groove accommodates an image sensor chip therein, and wherein the second groove is formed with a through hole;
a first electrode pad formed at a bottom surface of the first groove; and
a second electrode pad formed on the upper surface of the ceramic body, electrically connected to the first electrode pad;
wherein an edge between the first groove and the second groove has a curved shape,
wherein the second groove remains empty while the first groove accommodates the image sensor chip, and
wherein the through hole remains empty such that the second groove and the through hole form a continuous empty space.
2. The ceramic board as claimed in claim 1 , wherein the first electrode pad and the second electrode pad are electrically connected by an electrode line and a conductive via hole formed inside the ceramic body.
3. The ceramic board as claimed in claim 1 , wherein a width of the through hole is smaller than that of the second groove, and a width of the second groove is smaller than that of the first groove.
4. The ceramic board as claimed in claim 1 ,
wherein an area joined with the bottom surface of the first groove and a side surface of the second groove is tapered off.
5. An image sensor package using a ceramic board, the image sensor package comprising:
a ceramic board comprising:
a ceramic body having a first groove depressed from an upper surface of the ceramic body and a second groove depressed from a bottom surface of the first groove, wherein the first groove accommodates an image sensor chip therein, wherein the second groove is formed with a through hole, and wherein an edge between the first groove and the second groove has a curved shape;
a first electrode pad formed on the bottom surface of the first groove; and
a second electrode pad formed on the upper surface of the ceramic body, electrically connected to the first electrode pad; and
the image sensor chip comprising a third electrode pad electrically connected to the first electrode pad;
wherein the second groove is formed by being recessed on the bottom surface of the first groove,
wherein the second groove remains empty while the first groove accommodates the image sensor chip, and
wherein the through hole remains empty such that the second groove and the through hole form a continuous empty space.
6. The image sensor package as claimed in claim 5 , wherein a sealant interposed between the chip and the ceramic board is further included.
7. The image sensor package as claimed in claim 6 , wherein the sealant is a curable epoxy resin.
8. The image sensor package as claimed in claim 5 , wherein an electrode pad of the image sensor chip and the first electrode pad are electrically connected with a single bump or a stacked bump.
9. The image sensor package as claimed in claim 8 , wherein the bump is an Au bump.
10. The image sensor package as claimed in claim 5 , wherein the image sensor chip does not protrude from an upper surface of the ceramic body.
11. The image sensor package as claimed in claim 5 , wherein an FPC (Flexible Printed Circuit) electrically connected to the second electrode pad is further included.
12. The image sensor package as claimed in claim 5 , wherein the first and second electrode pads are electrically connected by an electrode line and a conductive via hole formed inside the ceramic body.
13. The image sensor package as claimed in claim 5 , wherein the image sensor chip receives light of a subject via the through hole.
14. The image sensor package as claimed in claim 5 , wherein a groove between the first groove and the second groove is further formed.
15. The ceramic board as claimed in claim 1 , further comprising a third groove formed by being recessed on the bottom surface of the second groove.
16. The ceramic board as claimed in claim 1 , wherein the first groove and the second groove are connected by an inclined surface.