Nitride-based semiconductor device
A semiconductor device according to an embodiment includes a nitride semiconductor layer, a gate electrode provided above the nitride semiconductor layer, a source electrode provided above the nitride semiconductor layer, a drain electrode provided above the nitride semiconductor layer at a side opposite to the source electrode with respect to the gate electrode, a first silicon nitride film provided above the nitride semiconductor layer between the drain electrode and the gate electrode, and a second silicon nitride film provided between the nitride semiconductor layer and the gate electrode, an atomic ratio of silicon to nitrogen in the second silicon nitride film being lower than an atomic ratio of silicon to nitrogen in the first silicon nitride film.
1. A semiconductor device, comprising:
a nitride semiconductor layer;
a gate electrode provided on the nitride semiconductor layer;
a source electrode provided on the nitride semiconductor layer;
a drain electrode provided on the nitride semiconductor layer at a side opposite to the source electrode with respect to the gate electrode;
a first silicon nitride film provided on the nitride semiconductor layer between the drain electrode and the gate electrode; and
a second silicon nitride film provided between the nitride semiconductor layer and the gate electrode, the second silicon nitride film being provided continuously from one edge of the gate electrode to the other edge of the gate electrode, an atomic ratio of silicon to nitrogen in the second silicon nitride film being lower than an atomic ratio of silicon to nitrogen in the first silicon nitride film.
2. The device according to claim 1 ,
wherein the atomic ratio of silicon to nitrogen in the first silicon nitride film is 0.75 or more.
3. The device according to claim 1 ,
wherein a hydrogen content of the first silicon nitride film is 10 at. % or more.
4. The device according to claim 1 ,
wherein a dielectric constant of the first silicon nitride film is 7 or less.
5. The device according to claim 1 ,
wherein the first silicon nitride film has tensile stress.
6. The device according to claim 1 ,
wherein a hydrogen content of the second silicon nitride film is lower than a hydrogen content of the first silicon nitride film.
7. The device according to claim 1 ,
wherein a chlorine content of the second silicon nitride film is 0.5 at. % or more.
8. The device according to claim 1 , further comprising,
a third silicon nitride film provided on the nitride semiconductor layer between the source electrode and the gate electrode, an atomic ratio of silicon to nitrogen in the third silicon nitride film being lower than the atomic ratio of silicon to nitrogen in the first silicon nitride film.
9. The device according to claim 1 ,
wherein the nitride semiconductor layer has a stacked structure of a gallium nitride and an aluminum gallium nitride stacked on the gallium nitride, and the first and second silicon nitride films are provided on the aluminum gallium nitride.