Method for making an electrical circuit
A method for making an electrical circuit comprises the steps of: forming a rigid printed circuit board having a plurality of electrical contacts on at least one surface; forming a multilayer flexible circuit board having a plurality of electrical components on at least one surface, and further having a bifurcated area along one edge; forming electrode pads on the inner surfaces of the bifurcated area of the flexible circuit board that are alignable respectively with the electrical contacts on the rigid circuit board when the bifurcated area is spread apart by about 180°; spreading the bifurcated area apart and aligning the electrode pads respectively with the electrical contacts; and forming an electrical connection between the electrode pads and the electrical contacts.
1. A method for making an electrical circuit comprising the steps of:
forming a rigid printed circuit board having a plurality of electrical contacts on a first surface of said rigid printed circuit board;
forming a multilayer flexible circuit board having a first surface and a second surface, and further including a plurality of electrical components on at least one of said first and second surfaces of said multilayer flexible circuit board, and further having a bifurcated area along one edge thereof, where respective layers of said multilayer flexible circuit board may be spread apart from one another;
forming electrode pads on selected surfaces of said bifurcated area of said multilayer flexible circuit board in such a pattern that each of said electrode pads is alignable respectively with one of each of said electrical contacts on said rigid printed circuit board when the two parts of said bifurcated area are spread apart from one another to form an angle of about 180°;
after the forming electrode pads step, spreading apart said bifurcated area and aligning each of said electrode pads respectively with one of said electrical contacts; and
after the spreading apart step, forming an electrical connection between said electrode pads and said electrical contacts.
2. The method of claim 1 wherein said electronic components are selected from the group consisting of: logic devices; memory devices; buffer circuits; timing circuits; analog, digital and mixed-mode circuits; optoelectronic devices; RF devices; resistors; capacitors; inductors; and antennas.
3. The method of claim 1 wherein said rigid printed circuit board is part of a computing device and said multilayer flexible circuit board comprises a memory module.
4. The method of claim 3 wherein said computing device is selected from the group consisting of: desktop computers; mobile computers; tablet computers; smart phones; and servers.
5. The method of claim 1 wherein said step of forming an electrical connection between said electrode pads and said electrical contacts employs a material selected from the group consisting of: isotropic conductive adhesive; anisotropic conductive adhesive; and solder.
6. A method for making an electrical circuit comprising the steps of:
forming a rigid printed circuit board, said rigid printed circuit board including a mechanical clamping device functionally connected to said rigid printed circuit board;
forming a multilayer flexible circuit board having a first surface and a second surface, and further including a plurality of electrical components on at least one of said first and second surfaces of said multilayer flexible circuit board, and further having a bifurcated area along one edge thereof where respective layers of said multilayer flexible circuit board may be spread apart from one another;
forming electrode pads on selected surfaces of said bifurcated area of said multilayer flexible circuit board in such a pattern that each of said electrode pads is alignable respectively with one of each of said electrical contacts on said mechanical clamping device when the two halves of said bifurcated area are spread apart from one another;
after the forming electrode pads step, spreading apart said bifurcated area and aligning each of said electrode pads respectively with one of said electrical contacts on said clamping device; and
after the spreading apart step, engaging said clamping device to form an electrical connection between said electrode pads and said electrical contacts and secure said multilayer flexible circuit board to said rigid printed circuit board.
7. The method of claim 6 wherein said electronic components are selected from the group consisting of: logic devices; memory devices; buffer circuits; timing circuits; analog, digital and mixed-mode circuits; optoelectronic devices; RF devices; resistors; capacitors; inductors; and antennas.
8. The method of claim 6 wherein said rigid printed circuit board is part of a computing device and said multilayer flexible circuit board comprises a memory module.
9. The method of claim 8 wherein said computing device is selected from the group consisting of: desktop computers; mobile computers; tablet computers; smart phones; and servers.
10. The method of claim 6 wherein said step of forming an electrical connection between said electrode pads and said electrical contacts employs a material selected from the group consisting of: isotropic conductive adhesive; anisotropic conductive adhesive; and solder.