Image pickup apparatus and camera module

1. An image pickup apparatus, comprising:

an optical device in which an optical element area for receiving light is formed on a side of a first surface of a substrate, and an external connection terminal is formed on a side of a second surface opposite to the first surface of the substrate;

a transparent conductive film formed to face the first surface of the substrate;

an electrode pad formed on the first surface of the substrate and configured to perform connection with a fixed potential;

a penetrating electrode connected to the electrode pad and formed to penetrate the substrate between the first surface and second surface, and

a sealing material configured to protect a side of the optical element area of the optical device,

wherein the transparent conductive layer is formed to fill a gap that extends between the first surface of the substrate on which the optical element area is formed and a bottom surface of the sealing material which is opposed to the first surface, the transparent conductive layer being in contact with the bottom surface of the sealing material,

wherein a pad different from the electrode pad is formed on the first surface of the substrate and the transparent conductive layer is formed to fill the gap excluding an area in which the different pad is formed,

wherein the transparent conductive layer is connected to the electrode pad, and

wherein the penetrating electrode is connected to the external connection terminal on the side of the second surface of the substrate.

2. The image pickup apparatus according to claim 1 , wherein the transparent conductive layer is formed as a moth eye structure so that at least an area opposed to the optical element area shows optical characteristics with a fine pattern.

3. The image pickup apparatus according to claim 1 , wherein at least the area opposed to the optical element area, a transparent film formed as a moth eye structure that shows optical characteristics with a fine pattern is disposed.

4. The image pickup apparatus according to claim 1 , wherein at least a part of the transparent conductive layer, a hole is formed in a depth direction.

5. The image pickup apparatus according to claim 1 , wherein an insulation film is formed on an area excluding an area opposed to the optical element area.

6. The image pickup apparatus according to claim 1 , wherein the different pad is in an electrically non-contacted state with the transparent conductive layer.

7. The image pickup apparatus according to claim 1 , wherein the transparent conductive film is formed in a non-contact state with the optical element area.

8. The image pickup apparatus according to claim 7 , wherein the transparent conductive layer is formed on the surface of the sealing material, which is opposed to the optical element area, across at least the optical element area and a cavity.

9. A camera module, comprising:

an image pickup apparatus including an optical element area for receiving light; and

a lens configured to form a subject image on the optical element area of the image pickup apparatus, wherein

the image pickup apparatus includes

an optical device in which an optical element area for receiving light is formed on a side of a first surface of a substrate, and an external connection terminal is formed on a side of a second surface opposite to the first surface of the substrate,

a transparent conductive film formed to face the first surface of the substrate,

an electrode pad formed on the first surface of the substrate and configured to perform connection with a fixed potential,

a penetrating electrode connected to the electrode pad and formed to penetrate the substrate between the first surface and second surface, and

a sealing material configured to protect a side of the optical element area of the optical device,

wherein the transparent conductive layer is formed to fill a gap that extends between the first surface of the substrate on which the optical element area is formed and a bottom surface of the sealing material which is opposed to the first surface, the transparent conductive layer being in contact with the bottom surface of the sealing material,

wherein a pad different from the electrode pad is formed on the first surface of the substrate and the transparent conductive layer is formed to fill the gap excluding an area in which the different pad is formed,

wherein the transparent conductive layer is connected to the electrode pad, and

wherein the penetrating electrode is connected to the external connection terminal on the side of the second surface of the substrate.

10. The camera module according to claim 9 , wherein the transparent conductive film is formed as a moth eye structure so that at least an area opposed to the optical element area shows optical characteristics with a fine pattern.

11. The camera module according to claim 9 , wherein in at least an area opposed to the optical element area, a transparent film formed as a moth eye structure that shows optical characteristics with a fine pattern is disposed.

12. The camera module according to claim 9 , wherein in at least a part of the transparent conductive film, a hole is formed in a depth direction.

13. The camera module according to claim 9 , wherein the transparent conductive film is formed in a non-contact state with the optical element area.

14. The camera module according to claim 13 , wherein the transparent conductive layer is formed on the surface of the sealing material, which is opposed to the optical element area, across at least the optical element area and a cavity.

15. The camera module according to claim 13 , wherein an insulation film is formed on an area excluding an area opposed to the optical element area.