Power supply device having heat conductive member
Provided is a power supply device that can suitably release heat with a small number of parts. In an AC-DC converter that is a power supply device according to an embodiment of the present invention, a heat conductive member thermally connected to a base plate is thermally connected to an upper surface of a stacked coil board including a main circuit board and circuit boards. This configuration causes heat generated in the stacked coil board to be transferred to the base plate also from the upper surface of the stacked coil board via the heat conducting member, whereby the heat release effect can be increased. In addition, since the heat conducting member is the only member used for releasing heat, the heat release effect can be increased while the number of parts is kept from increasing.
1. A power supply device comprising:
a stacked coil board including a plurality of coil boards stacked in a thickness direction;
a base plate having a main surface that is perpendicular to the thickness direction and on which the stacked coil board is placed and having a heat releasing function; and
a heat conducting member that is thermally connected to an upper surface of the stacked coil board opposite to and distal from the base plate and including a heat conductive region that is thermally connected to the base plate.
2. The power supply device according to claim 1 , wherein the heat conducting member is thermally connected to a side surface of the stacked coil board.
3. The power supply device according to claim 1 , further comprising a magnetic core inserted at approximately a center portion of a circuit pattern formed on the stacked coil board to form a magnetic path, wherein
the heat conducting member is thermally connected to the magnetic core on the upper surface side of the stacked coil board.
4. The power supply device according to claim 3 , wherein the magnetic core is covered by the heat conducting member on the upper surface side of the stacked coil board.
5. The power supply device according to claim 1 , further comprising a heat conductive resin interposed between the stacked coil board and the heat conducting member.
6. The power supply device according to claim 1 , wherein
a plurality of stacked coil boards are placed on the base plate, and
the heat conducting member is thermally connected to the stacked coil boards.
7. The power supply device according to claim 1 , wherein the heat conducting member includes the heat conductive region at center thereof when seen from the thickness direction.
8. A power supply device comprising:
a stacked coil board including a plurality of coil boards stacked in a thickness direction;
a base plate having a main surface that is perpendicular to the thickness direction and on which the stacked coil board is placed and having a heat releasing function;
a heat conducting member that is thermally connected to an upper surface of the stacked coil board distal from and opposite to the base plate and including a heat conductive region that is thermally connected to the base plate;
a magnetic core inserted at approximately a center portion of a circuit pattern formed on the stacked coil board to form a magnetic path, wherein
the heat conducting member is thermally connected to a side surface of the stacked coil board and the magnetic core on the upper surface side of the stacked coil board.