Semiconductor device and method of manufacturing the same
A semiconductor device includes a vertical IGFET in a first area of a semiconductor body, the vertical IGFET having a drift zone between a body zone and a drain electrode, the drift zone having a vertical dopant profile of a first conductivity type being a superposition of a first dopant profile declining with increasing distance from the drain electrode and dominating the vertical dopant profile in a first zone next to the drain electrode and a second dopant profile being a broadened peak dopant profile and dominating the vertical dopant profile in a second zone next to the body zone.
1. A semiconductor device, comprising:
a vertical IGFET in a first area of a semiconductor body, the vertical IGFET having a drift zone between a body zone and a drain electrode, the drift zone having a vertical dopant profile of a first conductivity type being a superposition of a first dopant profile declining with increasing distance from the drain electrode and dominating the vertical dopant profile in a first zone next to the drain electrode and a second dopant profile being a broadened peak dopant profile and dominating the vertical dopant profile in a second zone next to the body zone; and
a further semiconductor component formed in a second area of the semiconductor body, wherein the second dopant profile of the drift zone is absent in the second area,
wherein the vertical dopant profile of the drift zone has a local dopant maximum in the second zone and the local dopant maximum is located below gate trenches of the vertical IGFET.
2. The semiconductor device of claim 1 , wherein the vertical dopant profile has a shoulder portion in the second zone.
3. The semiconductor device of claim 1 , wherein the first dopant profile and the second dopant profile comprise different dopants.
4. The semiconductor device of claim 3 , wherein the different dopants comprise phosphor and arsenic.
5. The semiconductor device of claim 1 , wherein the broadened peak dopant profile is a Gaussian profile.
6. The semiconductor device of claim 1 , further comprising a drain zone between the drain electrode and the drift zone, the drain zone comprising a semiconductor substrate of the first conductivity type and the drift zone comprising at least one semiconductor layer grown on the semiconductor substrate.
7. A semiconductor device having a first area and a second area, the semiconductor device comprising:
a semiconductor substrate of a first conductivity type;
a semiconductor layer structure on the semiconductor substrate having a vertical dopant profile of a first conductivity type being a superposition of a first dopant profile formed in the first area and the second area and declining with increasing distance from the semiconductor substrate and a second dopant profile being a broadened peak dopant profile selectively formed in the first area; and
trenches formed in the semiconductor layer structure in the first area;
wherein the second dopant profile has a local dopant maximum located below the trenches.
8. The semiconductor device of claim 7 , wherein the first area comprises a vertical IGFET and the second area comprises a further semiconductor component.
9. The semiconductor device of claim 8 , wherein the semiconductor layer structure comprises a drift zone of the vertical IGFET in the first area of the semiconductor substrate and a junction isolation zone for insulating the further semiconductor component from the semiconductor substrate in the second area of the semiconductor substrate.
10. The semiconductor device of claim 7 , wherein the first dopant profile and the second dopant profile comprise different dopants.
11. The semiconductor device of claim 10 , wherein the different dopants comprise phosphor and arsenic.