Semiconductor devices and methods for manufacturing the same

1. A method for manufacturing a semiconductor device, comprising:

forming a first semiconductor layer and a second semiconductor layer sequentially on a substrate;

patterning the second semiconductor layer and the first semiconductor layer to form a fin;

forming an isolation layer on the substrate, wherein the isolation layer exposes a portion of the first semiconductor layer;

implanting ions into a portion of the substrate beneath the fin, to form a punch-through stopper;

forming a gate stack crossing over the fin on the isolation layer;

selectively etching the second semiconductor layer with the gate stack as a mask, to expose the first semiconductor layer;

selectively etching the first semiconductor layer, to form a void beneath the second semiconductor layer; and

forming a third semiconductor layer on the substrate, to form source/drain regions.

2. The method according to claim 1 , wherein after selectively etching the first semiconductor layer, the method further comprises:

filling the void with a dielectric material.

3. The method according to claim 1 , wherein forming an isolation layer comprises:

depositing on the substrate a dielectric material substantially covering the fin, wherein a portion of the dielectric material on top of the fin has a thickness sufficiently less than that of a portion of the dielectric material on the substrate; and

etching back the dielectric material.

4. The method according to claim 3 , wherein the portion of the dielectric material on top of the fin has a thickness less than ⅓ of the thickness of the portion of the dielectric material on the substrate.

5. The method according to claim 3 , wherein the dielectric material is formed by High Density Plasma (HDP) deposition.

6. The method according to claim 3 , wherein a plurality of fins are formed on the substrate, and a portion of the dielectric material on top of each of the fins has a thickness less than ½ of a spacing between the fin and its neighboring fin.

7. The method according to claim 1 , wherein before patterning the fin, the method further comprises:

forming a protection layer on the second semiconductor layer.

8. The method according to claim 3 , wherein before patterning the fin, the method further comprises:

forming a protection layer on the second semiconductor layer,

wherein the protection layer comprises the same dielectric material as the isolation layer.

9. The method according to claim 1 , wherein forming a punch-through stopper comprises:

performing n-type implantation for a p-type device, or performing p-type implantation for an n-type device.

10. The method according to claim 1 , wherein the third semiconductor layer is doped in situ while being formed.

11. The method according to claim 1 , wherein the third semiconductor layer is compressive stressed for a p-type device or tensile stressed for an n-type device.

12. The method according to claim 11 , wherein the substrate comprises Si, the first semiconductor layer comprises SiGe, the second semiconductor layer comprises Si, and the third semiconductor layer comprises SiGe or Si:C.

13. The method according to claim 1 , wherein the gate stack is a sacrificial gate stack, and the method further comprises removing the sacrificial gate stack and forming a further gate stack by a gate replacement process.

14. A semiconductor device, comprising:

a fin formed on a substrate;

a punch-through stopper formed in the substrate beneath the fin;

an isolation layer formed on the substrate; and

a gate stack formed on the isolation layer and crossing over the fin,

wherein the fin comprises a portion composed of a first semiconductor layer beneath the gate stack and a portion composed of a second semiconductor layer abutting the first semiconductor layer, and

wherein the semiconductor device further comprises source/drain regions formed in the portion composed of the second semiconductor layer and the isolation layer has a top surface lower than a bottom surface of the portion composed of the first semiconductor layer.

15. The semiconductor device according to claim 14 , further comprising an isolation island formed between the portion composed of the first semiconductor layer and the substrate.

16. The semiconductor device according to claim 14 , wherein the substrate comprises Si, the first semiconductor layer comprises Si, and the second semiconductor layer comprises SiGe or Si:C.

17. The semiconductor device according to claim 14 , wherein the portion composed of the second semiconductor layer is formed on a surface of the substrate through an opening in the isolation layer.

18. A semiconductor device, comprising:

a fin formed on a substrate;

a punch-through stopper formed in the substrate beneath the fin;

an isolation layer formed on the substrate; and

a gate stack formed on the isolation layer and crossing over the fin,

wherein the fin comprises a portion of a first semiconductor layer beneath the gate stack and a portion composed of a second semiconductor layer abutting the first semiconductor layer, and

an isolation island formed between the portion composed of the first semiconductor layer and the substrate;

wherein the semiconductor device further comprises source/drain regions formed in the portion composed of the second semiconductor layer.

19. The semiconductor device according to claim 18 , wherein the isolation layer has a top surface lower than a bottom surface of the portion composed of the first semiconductor layer.

20. The semiconductor device according to claim 18 , wherein the substrate comprises Si, the first semiconductor layer comprises Si, and the second semiconductor layer comprises SiGe or Si:C.