Multilayer ceramic capacitor, and circuit board having multilayer ceramic capacitor embedded therein

1. A multilayer ceramic capacitor comprising:

a 1005-sized ceramic body including a dielectric layer and a cover layer;

first and second internal electrodes disposed to face each other, while having the dielectric layer interposed therebetween; and

a first external electrode electrically connected to the first internal electrode and a second external electrode electrically connected to the second internal electrode,

wherein in a length-thickness (L-T) cross-section of the ceramic body, in the case in which a square is defined as including sides parallel to a central portion of a first main surface of the ceramic body, and vertices disposed in a diagonal direction on outer surfaces of the ceramic body, the sides having a length of 30 μm, when an area of a region of the square not occupied by the ceramic body is defined as A-out and a thickness of the cover layer is defined as t, the following Equations are satisfied: 9 μm 2 ≦A-out and A-out/t≦3.7 μm.

2. The multilayer ceramic capacitor of claim 1 , wherein the ceramic body has a thickness of 0.09 mm or less after firing.

3. The multilayer ceramic capacitor of claim 1 , wherein the cover layer includes upper and lower cover layers, and the thickness t of the cover layer is an average of thicknesses of the upper and lower cover layers.

4. A circuit board having a multilayer ceramic capacitor embedded therein, the circuit board comprising:

a circuit board part provided with a groove for receiving an electronic component; and

a multilayer ceramic capacitor including a 1005-sized ceramic body including a dielectric layer and a cover layer; first and second internal electrodes disposed to face each other, while having the dielectric layer interposed therebetween; and a first external electrode electrically connected to the first internal electrode and a second external electrode electrically connected to the second internal electrode, and disposed in the groove,

wherein in a length-thickness (L-T) cross-section of the ceramic body, in the case in which a square is defined as including sides parallel to a central portion of a first main surface of the ceramic body, and vertices disposed in a diagonal direction on outer surfaces of the ceramic body, the sides having a length of 30 μm, when an area of a region of the square not occupied by the ceramic body is defined as A-out and a thickness of the cover layer is defined as t, the following Equations are satisfied: 9 μm 2 ≦A-out and A-out/t≦3.7 μm.

5. A manufacturing method for a multilayer ceramic capacitor, the manufacturing method comprising:

preparing ceramic green sheets;

forming internal electrode patterns on the ceramic green sheets using a conductive paste for an internal electrode;

forming a 1005-sized ceramic body including first and second internal electrodes disposed to face each other, a dielectric layer, and a cover layer therein, by stacking the ceramic green sheets having the internal electrode patterns formed thereon and the ceramic green sheets having no internal electrode patterns formed thereon, and then firing the stacked ceramic green sheets;

polishing edges of the ceramic body; and

forming a first external electrode electrically connected to the first internal electrode and a second external electrode electrically connected to the second internal electrode,

wherein in a length-thickness (L-T) cross-section of the ceramic body, in the case in which a square is defined as including sides parallel to a central portion of a first main surface of the ceramic body, and vertices disposed in a diagonal direction on outer surfaces of the ceramic body, the sides having a length of 30 μm, when an area of a region of the square not occupied by the ceramic body is defined as A-out and a thickness of the cover layer is defined as t, the following Equations are satisfied: 9 μm 2 ≦A-out and A-out/t≦3.7 μm.

6. The manufacturing method of claim 5 , wherein the ceramic body has a thickness of 0.09 mm or less after firing.

7. The manufacturing method of claim 5 , wherein the cover layer includes upper and lower cover layers, and the thickness t of the cover layers is an average of thicknesses of the upper and lower cover layers.