Semiconductor structure and manufacturing method thereof
A semiconductor structure includes a semiconductor substrate and a pad. The pad is on a top surface of the semiconductor substrate. The semiconductor structure further includes a circuit board and a bump. The circuit board has a contact area corresponding to the pad on the top surface of the semiconductor substrate, and the bump is between the pad on the top surface of the semiconductor substrate and the contact area, wherein the contact area is a non-metallic surface.
1. A semiconductor structure, comprising:
a semiconductor substrate;
a pad on a top surface of the semiconductor substrate;
a circuit board including a contact area corresponding to the pad on the top surface of the semiconductor substrate;
a bump between the pad on the top surface of the semiconductor substrate and the contact area, wherein the contact area is a non-metallic surface, and the bump is in contact with the contact area in non-wetted manner; and
a second bump adjacent the bump, wherein the second bump is taller than the bump.
2. The semiconductor structure of claim 1 , wherein the bump is in contact with the pad on the top surface of the semiconductor substrate in wetted manner.
3. The semiconductor structure of claim 1 , wherein the contact area is a portion of a top electrically insulative surface of the circuit board.
4. The semiconductor structure of claim 1 , wherein the second bump is bonded with a conductive pad on the circuit board in wetted manner.
5. The semiconductor structure of claim 1 , wherein the second bump includes an aspect ratio greater than an aspect ratio of the bump.
6. The semiconductor structure of claim 1 , wherein the pad on the top surface of the semiconductor substrate is electrically isolated from any internal electrical circuit of the semiconductor structure.
7. A semiconductor structure, comprising:
a semiconductor substrate;
a pad on a top surface of the semiconductor substrate;
a circuit board including a contact area corresponding to the pad on the top surface of the semiconductor substrate; and
a bump between the pad on the top surface of the semiconductor substrate and the contact area, wherein the contact area is a non-metallic surface, and the contact area is an electrically insulative pad on a top surface of the circuit board.
8. The semiconductor structure of claim 7 , wherein the electrically insulative pad is in a recess of the electrically insulative top surface of the circuit board.
9. The semiconductor structure of claim 7 , wherein the electrically insulative pad is polymeric material.
10. A surface mount technology (SMT) semiconductor structure, comprising:
a semiconductor device;
a circuit board; and
a plurality of bumps configured to bond the semiconductor device and the circuit board, wherein at least one of the plurality of bumps is contacting with an electrical insulative pad on the circuit board.
11. The surface mount technology semiconductor structure of claim 10 , wherein the at least one of the plurality of bumps is contacting the electrical insulative pad of the circuit board in non-wetted manner.
12. The surface mount technology semiconductor structure of claim 10 , wherein the circuit board includes a plurality of electrical insulative pads over a top surface of the circuit board and configured to be in contact with a corresponding bump.
13. The surface mount technology semiconductor structure of claim 12 , wherein the plurality of electrical insulative pads are located in a pad array.
14. The surface mount technology semiconductor structure of claim 13 , wherein the plurality of electrical insulative pads are arranged symmetrical to a center of the pad array.
15. A method of manufacturing a semiconductor structure, comprising:
providing a semiconductor substrate;
forming a pad on a top surface of the semiconductor substrate;
providing a circuit board with a non-metallic contact area corresponding to the pad on the top surface of the semiconductor substrate;
forming a bump between the pad on the top surface of the semiconductor substrate and the non-metallic contact area to bond the semiconductor substrate and the circuit board, wherein the bump contacts the non-metallic contact area; and
forming a recess on a top surface of the circuit board, wherein the recess is configured to accommodate the non-metallic contact area.
16. The method of claim 15 , wherein the bump contacts the non-metallic contact area in non-wetted manner.
17. The method of claim 15 , further comprising forming a polymer on the non-metallic contact area.
18. The method of claim 15 , further comprising forming a plurality of non-metallic contact areas on the circuit board.
19. The method of claim 15 , wherein the forming a bump between the pad on the top surface of the semiconductor substrate and the non-metallic contact area comprises placing a solder ball on the pad on the top surface of the semiconductor substrate.