Method of protecting an electrical component in a laminate
A method for protecting an electrical component in a support layer of a functional laminate comprises the steps of providing the support layer with a first hole, a second hole and an opening connecting the first and the second holes together, positioning an electrical component inside the first hole, placing a patch of plastic material in the second hole, and causing the material of the patch to flow through the opening from the second hole to the first hole, flowing around the electrical component in order to surround it.
1. A method for protecting an electrical component in a support layer of a functional laminate, the method comprising the steps of
providing the support layer with a first hole, a second hole and an opening connecting the first and the second holes together;
positioning an electrical component inside the first hole;
placing a solid patch of plastic material in the second hole;
causing the material of the patch to flow through the opening from the second hole to the first hole, flowing around the electrical component in order to surround it.
2. The method of claim 1 , wherein the step of causing the material of the patch to flow is a lamination step involving the support layer, whereby the patch melts down as it is submitted to heating and pressure.
3. The method of claim 1 , wherein the melting point of the material of the patch is below the melting point of the material of the support layer.
4. The method of claim 1 , further comprising a step of choosing a patch volume such as to correspond at least to the addition of a volume of the second hole, a volume of the opening and a volume filling the surrounding of the electrical component in the first hole.
5. The method of claim 1 , wherein a plurality of second holes receive each one of a plurality of patches and wherein the material of this plurality of patches flows through a plurality of openings connecting each of the second holes to the first hole.
6. The method of claim 1 , wherein the patch is originally thicker than the support layer such that it protrudes out of the second hole when it is placed in it.
7. The method of claim 1 , wherein the support layer is provided with a carrier layer such as to create a below surface covering at least a part of bottom apertures corresponding respectively to the first or second holes or the opening on one the bottom face of the support layer.
8. The method of claim 7 , wherein the carrier layer is sealed to the support layer such that at least a part of the said bottom apertures are hermitically closed.
9. The method of claim 1 , wherein the electrical component is a RFID chip connected to an antenna fixed to the support layer.