IP Library Granted Patent US 9,362,093
Granted Patent B2
US 9,362,093 · App. 14/138,833 · Granted Jun 7, 2016

Plasma enhanced chemical vapor deposition (PECVD) source

Inventors: Daniel Theodore Crowley (Owatonna, MN); Patrick Lawrence Morse (Tuscon, AZ); William A. Meredith, Jr. (Faribault, MN); John Robert German (Owatonna, MN); Michelle Lynn Neal (Albert Lea, MN)
Assignee: Sputtering Components, Inc.
H01J37/3405H01J37/345H01J37/3417H01J37/3438H01J37/3444
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Quick Facts
Patent No.
US 9,362,093
App. No.
14/138,833
Granted
Jun 7, 2016
Kind
B2
Abstract

One embodiment is directed to a plasma source comprising a body in which a cavity is formed and at least two self-contained magnetron assemblies disposed within the cavity. The magnetron assemblies are mutually electrically isolated from each other and from the body. In one implementation of such an embodiment, the self-contained magnetron assemblies comprise closed-drift magnetron assemblies. Other embodiments are disclosed.

Claims (32)

1. A plasma source comprising:

a body in which a cavity is formed; and

at least two self-contained magnetron assemblies disposed within the cavity;

wherein the magnetron assemblies are mutually electrically isolated from each other and from the body.

2. The plasma source of claim 1 , wherein the magnetron assemblies comprise closed-draft magnetron assemblies.

3. The plasma source of claim 1 , wherein each of the magnetron assemblies comprises at least one electrode, at least one magnet, and a cooling sub-system.

4. The plasma source of claim 3 , wherein at least one of the magnetron assemblies comprises a core to which at least one of the electrode and the magnet are connected.

5. The plasma source of claim 4 , wherein the cooling sub-system in at least one of the magnetron assemblies comprises at least one channel formed in the core.

6. The plasma source of claim 4 , wherein the cooling sub-system in at least one of the magnetron assemblies comprises at least one channel formed in a target portion of at least one electrode included in the magnetron assembly.

7. The plasma source of claim 1 , further comprising a manifold or conduit to distribute a process gas within the plasma source.

8. The plasma source of claim 7 , wherein the manifold or conduit to distribute the process gas comprises a binary manifold.

9. The plasma source of claim 1 , further comprising a manifold or conduit to distribute a precursor gas.

10. The plasma source of claim 1 , wherein at least one power supply is connected between the magnetron assemblies so that respective electrodes in the magnetron assemblies are alternately biased to have polarities opposite to one another.

11. The plasma source of claim 10 , wherein the at least one power supply comprises at least one of an alternating current power supply and a bi-polar pulsed power supply.

12. The plasma source of claim 1 , wherein plasma source is configured so that the body of the plasma source is at one of a floating potential or ground potential.

13. The plasma source of claim 1 , wherein plasma source is configured so that the body of the plasma source is biased to a particular non-ground potential.

14. The plasma source of claim 1 , wherein the magnetron assemblies comprise planar magnetrons.

15. A method of sourcing plasma comprising:

supplying a process gas to a cavity formed within a body of a plasma source, the plasma source comprising at least two self-contained magnetron assemblies disposed within the cavity, wherein the magnetron assemblies are mutually electrically isolated from each other and from the body;

alternately biasing respective electrodes in the magnetron assemblies to have polarities opposite to one another; and

directing the plasma substantially towards a substrate.

16. The method of claim 15 , further comprising directing a supply of precursor gas into the plasma in the vicinity of the substrate.

17. The method of claim 15 , wherein the magnetron assemblies comprise closed-draft magnetron assemblies.

18. The method of claim 15 , wherein supplying the process gas comprises supplying the process gas using a binary manifold.

19. The method of claim 15 , wherein supplying the precursor gas comprises supplying the precursor gas using a binary manifold.

20. A plasma source comprising:

a body in which a cavity is formed;

at least one self-contained magnetron assembly disposed within the cavity;

at least two non-magnetron electrodes disposed within the cavity; and

an alternating current (AC) power supply having an output coil;

wherein the at least two non-magnetron electrodes are mutually electrically isolated from each other and from the body incorporating the cavity; and

wherein the magnetron assembly is connected to a center tap of the output coil of the AC power supply and the non-magnetron electrodes are connected to end taps of the output coil of the AC power supply.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 12, 2019
From: SPUTTERING COMPONENTS INC
To: BUEHLER AG
Reel/Frame 049446/0744 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 24, 2014
From: CROWLEY, DANIEL THEODORE; MORSE, PATRICK LAWRENCE; MEREDITH, WILLIAM A., JR.; GERMAN, JOHN ROBERT; NEAL, MICHELLE LYNN
To: SPUTTERING COMPONENTS, INC.
Reel/Frame 032282/0202 →
Continuity (2)
Provisional Application 61746734 · Dec 28, 2012
Related Publication 20140184073A1 · Jul 3, 2014