Method and apparatus of ESD protection in stacked die semiconductor device

1. An apparatus, comprising:

an interposer; and

a plurality of dies stacked on the interposer;

wherein:

the interposer includes a first conductive network of a first trigger bus;

each of the plurality of dies includes a second conductive network of a second trigger bus;

each of the plurality of dies includes a first ESD detection circuit and a first ESD power clamp, the first ESD detection circuit and the first ESD power clamp are electrically connected between a first power line and a second power line, and are electrically connected to the second conductive network of the second trigger bus;

the second conductive network of the second trigger bus in each of the plurality of dies is electrically connected to the first conductive network of the first trigger bus;

the interposer includes a second ESD power clamp; and

when the first ESD detection circuit in one of the plurality of dies receives an input signal, the first ESD detection circuit is configured to generate an output signal to the first conductive network by way of the corresponding second conductive network of the second trigger bus, to control the first ESD power clamps in each of the plurality of dies.

2. The apparatus of claim 1 , wherein the first conductive network of the first trigger bus is implemented as a mesh type network or a stripe type network.

3. The apparatus of claim 1 , wherein the second conductive network of the second trigger bus is implemented as a mesh type network or a stripe type network.

4. The apparatus of claim 1 , wherein the first or the second conductive networks are formed by metal lines, conductive vias, oxide definition (OD), polysilicon (POLY), or redistribution layer (RDL).

5. The apparatus of claim 1 , wherein the interposer includes a second ESD detection circuit, the second ESD detection circuit and the second ESD power clamp are electrically connected between a third power line and a fourth power line, and are electrically connected to the first conductive network of the first trigger bus.

6. The apparatus of claim 5 , wherein the first and the second conductive networks are configured to trigger the first ESD power clamp in each of the plurality of dies and the second ESD power clamp in the interposer to discharge ESD current from the first power line to the second power line, and from the third power line to the fourth power line respectively.

7. An apparatus, comprising:

an interposer; and

a plurality of dies stacked on the interposer;

wherein:

the interposer includes a first conductive network of a first trigger bus and a second conductive network of a first ESD bus;

each of the plurality of dies includes a third conductive network of a second trigger bus and a fourth conductive network of a second ESD bus;

each of the plurality of dies further includes an first ESD detection circuit and an first ESD power clamp, the first ESD detection circuit and the first ESD power clamp are electrically connected between the fourth conductive network of the second ESD bus and a first power line, and are electrically connected to the third conductive network of the second trigger bus;

the third conductive network of the second trigger bus in each of the plurality of dies is electrically connected to the first conductive network of the first trigger bus;

the fourth conductive network of the second ESD bus in each of the plurality of dies is electrically connected to the second conductive network of the first ESD bus; and

when the first ESD detection circuit in one of the plurality of dies receives an input signal, the first ESD detection circuit is configured to generate an output signal to the first conductive network of the first trigger bus by way of the corresponding third conductive network of the second trigger bus to control the first ESD power clamps in each of the plurality of dies.

8. The apparatus of claim 7 , wherein the first conductive network of the first trigger bus or the third conductive network of the second trigger bus are implemented as a mesh type network or a stripe type network.

9. The apparatus of claim 7 , wherein the second conductive network of the first ESD bus or the fourth conductive network of the second ESD bus are implemented as a mesh type network or a stripe type network.

10. The apparatus of claim 7 , wherein the first, the second, the third or the fourth conductive networks are formed by metal lines, conductive vias, oxide definition (OD), polysilicon (POLY), or redistribution layer (RDL).

11. The apparatus of claim 7 , wherein each of the plurality of dies further includes another ESD power clamp connected between the first power line and a second power line, and connected to the third conductive network of the second trigger bus.

12. The apparatus of claim 7 , wherein the interposer includes an second ESD detection circuit and an second ESD power clamp, the second ESD detection circuit and the second ESD power clamp are electrically connected between the second conductive network of the first ESD bus and a third power line, and are electrically connected to the first conductive network of the first trigger bus.

13. The apparatus of claim 12 , wherein the first and the third conductive networks are configured to trigger the first ESD power clamps in each of the plurality of dies and the second ESD power clamp in the interposer to discharge ESD current from the fourth conductive network of the second ESD bus to the first power line, and from the second conductive network of the first ESD bus to the third power line respectively.

14. The apparatus of claim 7 , wherein the interposer further includes another ESD power clamp connected between a third power line and a fourth power line, and connected to the first conductive network of the first trigger bus.

15. A method of configuring an integrated circuit, comprising:

connecting conductive networks of trigger buses of one or more stacked dies and an interposer together; and

connecting one or more ESD detection circuits and a plurality of ESD power clamps to the conductive networks of the trigger buses in each stacked die and/or the interposer, wherein the interposer includes at least one of the plurality of ESD power clamps.

16. The method of claim 15 , further comprising the one or more ESD detection circuits causing the ESD power clamps to turn on in each stacked die and/or the interposer to discharge an ESD current substantially at a same time.

17. The method of claim 15 , further comprising generating individual conductive network for corresponding ESD buses of one or more stacked dies and/or the interposer, and connecting the conductive networks of the ESD buses together.

18. The method of claim 17 , wherein the conductive networks of the trigger buses or the conductive networks of the ESD buses are implemented as a mesh type network or a stripe type network.

19. The method of claim 17 , wherein the conductive networks of the trigger buses or the conductive networks of the ESD buses are formed by metal lines, conductive vias, oxide definition (OD), polysilicon (POLY), or redistribution layer (RDL).

20. The method of claim 15 , further comprising connecting one or more ESD detection circuits and one or more ESD power clamps in each of the one or more stacked dies and/or the interposer to the conductive networks of the trigger buses.