Circuit board and method of manufacturing same
Provided is a method of manufacturing a circuit board including preparing a board structural body ( 11 ) and covering a conductor circuit element ( 13 ) on an outermost layer of the board structural body ( 11 ) with a cover film ( 14 ), wherein a heat treatment is performed while having a release material ( 15 ) interposed between the cover film ( 14 ) and a heat-processing device. The release material ( 15 ) is a laminate at least including, sequentially from the cover film toward the heat-processing device, a low friction film ( 16 ) selected from an ultrahigh-molecular-weight polyethylene film and a polytetrafluoroethylene film, a first aluminum foil ( 17 ), a first high-density polyethylene film ( 18 a ), a second high-density polyethylene film ( 18 b ), and a second aluminum foil ( 19 ). The first high-density polyethylene film ( 18 a ) and the second high-density polyethylene film ( 18 b ) are positioned such that respective MD directions are perpendicular to each other.
1. A method of manufacturing a circuit board, the method comprising:
preparing a board structural body comprising a board and a conductor circuit element disposed on a surface of the board; and
covering the conductor circuit element on an outermost layer of the board structural body with a cover film comprising a thermoplastic polymer capable of forming an optically anisotropic melt phase,
wherein covering comprises applying a heat treatment while having a release material interposed between the cover film and a heat-processing device in order to melt-bond the cover film to the structural body, the release material is a laminate comprising, sequentially from the cover film toward the heat-processing device,
a low friction film selected from the group consisting of an ultrahigh-molecular-weight polyethylene film and a polytetrafluoroethylene film;
a first aluminum foil;
a first high-density polyethylene film having a machine direction;
a second high-density polyethylene film having a machine direction; and
a second aluminum foil, and
the first high-density polyethylene film and the second high-density polyethylene film are positioned such that respective machine directions are perpendicular to each other.
2. The method of claim 1 , wherein the cover film is a thermoplastic liquid crystal polymer film with a thickness larger than the conductor circuit element.
3. The method of claim 1 ,
wherein each of the first and second high-density polyethylene films has a viscosity average molecular weight of from 20,000 to 500,000 and
the low friction film is an ultrahigh-molecular-weight polyethylene film having a viscosity average molecular weight of not lower than 1,000,000, or a polytetrafluoroethylene film having an apparent melt viscosity at 380° C. of not lower than 10 10 poise.
4. The method of claim 1 ,
wherein the conductor circuit element comprises a first differential signal line and a second differential signal line, and a change in distance G between the first differential signal line and the second differential signal line before and after the covering is within 5%.