Memory device

1. A memory device comprising:

a first memory cell array;

a second memory cell array;

a multiplexer arranged between the first memory cell array and the second memory cell array, the multiplexer controlling the first memory cell array and the second memory cell array, and the multiplexer including a transistor;

a first line connecting the first memory cell array and the second memory cell array, the transistor driving the first memory cell array and the second memory cell array by controlling an electrical connection of the first line;

a second line connecting the first memory cell array and the second memory cell array; and

a third line connected to the first line via the transistor, the third line being connected to a first end of the transistor via a first contact arranged between the first and second lines, and the first line being connected to a second end of the transistor via a second contact.

2. The device according to claim 1 , wherein:

the third line is arranged above the first and second lines, and

the transistor is arranged below the first and second lines.

3. The device according to claim 1 , further comprising a fourth line adjacent to the third line,

wherein a pitch of the first and second lines is narrower than that a pitch of the third and fourth lines.

4. The device according to claim 1 , further comprising a plate interconnection between the first memory cell array and the second memory cell array,

wherein the first contact is relayed by the plate interconnection and connects the third line and the transistor.

5. The device according to claim 4 , wherein the first line includes:

first portions extending from the first memory cell array and the second memory cell array; and

a second portion arranged in a layer different from a layer of the first portions between the first memory cell array and the second memory cell array, and connecting the first memory cell array and the second memory cell array, and

wherein the plate interconnection is arranged in the same layer as the first portions.

6. The device according to claim 4 , wherein the first line includes:

first portions extending from the first memory cell array and the second memory cell array; and

a second portion arranged in a layer different from a layer of the first portions between the first memory cell array and the second memory cell array, and connecting the first memory cell array and the second memory cell array,

wherein the second line includes:

third portions extending from the first memory cell array and the second memory cell array; and

a fourth portion arranged in a layer different from a layer of the third portions between the first memory cell array and the second memory cell array, and connecting the first memory cell array and the second memory cell array, and

wherein the first contact is arranged between the second and fourth portions, and connects the third line and the transistor.

7. The device according to claim 5 , further comprising a fifth line in the layer in which the second portion is arranged.

8. The device according to claim 1 , wherein the transistor is one of a buried gate transistor and a planar transistor.

9. The device according to claim 1 , wherein the multiplexer comprises:

a first part controlling the first memory cell array; and

a second part controlling the second memory cell array, and

wherein the device further comprises a driver driving both of the first and second parts.

10. The device according to claim 1 , wherein the multiplexer is provided in common to the first memory cell array and the second memory cell array, and

wherein the device further comprises a driver driving the multiplexer.

11. The device according to claim 10 , further comprising a line connecting the first memory cell array and the second memory cell array,

wherein the line includes:

a first portion acting as a bit line; and

a second portion acting as a source line, arranged in a same layer as a layer of the bit line.

12. The device according to claim 10 , further comprising a line connecting the first memory cell array and the second memory cell array,

wherein the line includes:

a first portion acting as a bit line; and

a second portion acting as a source line, arranged in a layer different from a layer of the bit line.

13. The device according to claim 10 , further comprising a line connecting the first memory cell array and the second memory cell array,

wherein the line includes:

a first portion acting as a bit line; and

a second portion acting as a connection line, arranged in a layer different from a layer of the bit line.

14. The device according to claim 1 , wherein the first and second memory cell arrays include resistance change elements.

15. The device according to claim 1 , wherein the first and second memory cell arrays include magnetoresistive effect elements.

16. A memory device comprising:

a first memory cell array;

a second memory cell array;

a first line connecting the first memory cell array and the second memory cell array;

a second line connecting the first memory cell array and the second memory cell array;

a third line connected to the first and second lines via a transistor; and

a multiplexer including the transistor,

wherein the third line is connected to a first end of the transistor via a first contact arranged between the first and second lines,

wherein the first line is connected to a second end of the transistor via a second contact,

wherein the third line is arranged above the first and second lines, and

wherein the transistor is arranged below the first and second lines.

17. The device according to claim 16 , further comprising a fourth line adjacent to the third line,

wherein a pitch of the first and second lines is narrower than a pitch of the third and fourth lines.