Laminated ceramic electronic component
In a laminated ceramic capacitor, a cylindrical ceramic part of its ceramics includes, in a manner not exposed to the surface of the ceramics, a cylinder-shaped high-void-ratio part which has a void ratio higher than the void ratio in the cylindrical ceramic part other than the high-void-ratio part and which has two layered parts facing the left and right sides of each layered conductor, respectively, as well as two layered parts facing the outer surfaces of the two outermost layered conductors, respectively. The laminated ceramic electronic component inhibits cracking of its sintered chip.
1. A laminated ceramic electronic component having a sintered chip of roughly rectangular solid shape constituted by ceramics and many layered conductors arranged therein in a manner facing each other, with the ceramics constituting the sintered chip divided into many layered ceramic parts present between the layered conductors and a cylindrical ceramic part present in a manner surrounding the entire layered conductors;
wherein the cylindrical ceramic part of the ceramics includes, in a manner not exposed to a surface of the cylindrical ceramic part nor contacting the layered conductors, a high-void-ratio part which has a void ratio higher than a void ratio at any part of the cylindrical ceramic part other than the high-void-ratio part and which also has at least two layer-parts facing each other and extending in a direction parallel to a lamination direction of the layered conductors along sides of the layered conductors, in which high-void-ratio part pores are randomly distributed.
2. A laminated ceramic electronic component according to claim 1 , wherein the high-void-ratio part also integrally has two layered parts facing outer surfaces of two outermost layered conductors, respectively, in addition to the two layered parts each facing one side of each layered conductor.
3. A laminated ceramic electronic component according to claim 1 , wherein the two layered parts in the high-void-ratio part, which are each facing one side of each layered conductor, do not contact any layered conductor.
4. A laminated ceramic electronic component according to claim 1 , wherein a void ratio in the high-void-ratio part is in a range of 2 to 20%, and a void ratio in the cylindrical ceramic part other than the high-void-ratio part is less than 2%.
5. A laminated ceramic electronic component according to claim 1 , wherein said laminated ceramic electronic component is a laminated ceramic capacitor.
6. A laminated ceramic electronic component according to claim 2 , wherein the two layered parts in the high-void-ratio part, which are each facing one side of each layered conductor, do not contact any layered conductor.
7. A laminated ceramic electronic component according to claim 2 , wherein a void ratio in the high-void-ratio part is in a range of 2 to 20%, and a void ratio in the cylindrical ceramic part other than the high-void-ratio part is less than 2%.
8. A laminated ceramic electronic component according to claim 3 , wherein a void ratio in the high-void-ratio part is in a range of 2 to 20%, and a void ratio in the cylindrical ceramic part other than the high-void-ratio part is less than 2%.
9. A laminated ceramic electronic component according to claim 6 , wherein a void ratio in the high-void-ratio part is in a range of 2 to 20%, and a void ratio in the cylindrical ceramic part other than the high-void-ratio part is less than 2%.
10. A laminated ceramic electronic component according to claim 2 , wherein said laminated ceramic electronic component is a laminated ceramic capacitor.
11. A laminated ceramic electronic component according to claim 3 , wherein said laminated ceramic electronic component is a laminated ceramic capacitor.
12. A laminated ceramic electronic component according to claim 6 , wherein said laminated ceramic electronic component is a laminated ceramic capacitor.
13. A laminated ceramic electronic component according to claim 4 , wherein said laminated ceramic electronic component is a laminated ceramic capacitor.
14. A laminated ceramic electronic component according to claim 7 , wherein said laminated ceramic electronic component is a laminated ceramic capacitor.
15. A laminated ceramic electronic component according to claim 8 , wherein said laminated ceramic electronic component is a laminated ceramic capacitor.
16. A laminated ceramic electronic component according to claim 9 , wherein said laminated ceramic electronic component is a laminated ceramic capacitor.
17. A laminated ceramic electronic component according to claim 1 , wherein the pores have a diameter of approximately 0.1 μm to approximately 3.0 μm.
18. A laminated ceramic electronic component according to claim 1 , wherein oxides of Ba, Mg, Ho, and Si are contained and segregated in the high-void-ratio part.