Semiconductor device and method for forming the same
A semiconductor device includes a semiconductor substrate including an active region defined by a device isolation film; a gate electrode filled in the active region; a bit line contact structure coupled to an active region between the gate electrodes; and a line-type bit line electrode formed over the bitline contact structure. The bit line contact structure includes a bit line contact formed over the active region; and an ohmic contact layer formed over the bit line contact.
1. A semiconductor device comprising:
a semiconductor substrate including an active region defined by a device isolation film;
a buried gate electrode formed in the active region;
a bit line contact structure coupled to the active region between the buried gate electrode and a neighboring buried gate electrode; and
a line-type bit line electrode formed over the bit line contact structure,
wherein a bottom surface of the bit line contact is disposed lower than an upper surface of the semiconductor substrate,
wherein the bit line contact structure includes:
a bit line contact formed over the active region, and
an ohmic contact layer separating the bit line electrode and the bit line contact,
wherein the ohmic contact layer and a barrier film are disposed over the bit line contact and fill a trench in an insulation film, and
wherein the bit line electrode is located on the ohmic contact layer, the bit line contact directly contacts the ohmic contact layer, and the barrier film is located on the bit line contact.
2. The semiconductor device according to claim 1 , wherein the barrier film is formed over the ohmic contact layer.
3. The semiconductor device according to claim 1 , wherein the barrier film is a line-type barrier film formed between the ohmic contact layer and the bit line electrode.
4. The semiconductor device according to claim 1 , wherein the ohmic contact layer includes a cobalt silicide CoSix layer, where x is an integer.
5. The semiconductor device according to claim 2 , wherein the barrier film includes a titanium (Ti) film, a titanium nitride (TiN) film, or a stacked structure (Ti/TiN) of the titanium (Ti) film and the titanium nitride (TiN) film.
6. The semiconductor device according to claim 1 , wherein the bit line electrode is formed in a cell region, and
wherein the bit line electrode and a gate electrode in a peripheral region are formed substantially at the same time.
7. The semiconductor device according to claim 1 , wherein the ohmic contact layer is formed only over the bit line contact.
8. The semiconductor device according to claim 2 , wherein the barrier film is formed only over the bit line contact.
9. The semiconductor device according to claim 1 , wherein the ohmic contact layer provides an interface between the bit line electrode and the bit line contact.
10. The semiconductor device according to claim 1 , wherein the insulation film is formed on a side surface of the ohmic contact layer and an upper surface of the buried gate electrode.