Reflow process and tool

1. A method comprising:

moving a package workpiece into a chamber of a reflow tool, an exhaust system set at a first pressure removing gas from the chamber during the moving the package workpiece into the chamber;

enclosing the package workpiece in an enclosed environment of the chamber;

causing an oxygen content of the enclosed environment of the chamber to be less than 40 parts per million (ppm), the causing the oxygen content to be less than 40 ppm comprising setting the exhaust system at a second pressure less than the first pressure; and

performing a reflow process in the enclosed environment of the chamber while the oxygen content is less than 40 ppm, the reflow process reflowing a reflowable material of the package workpiece.

2. The method of claim 1 , wherein the enclosing the package workpiece comprises closing a door of the chamber to form the enclosed environment of the chamber.

3. The method of claim 1 , wherein the causing the oxygen content to be less than 40 ppm comprises supplying an inert gas to the enclosed environment while the exhaust system removes gas from the enclosed environment.

4. The method of claim 3 , wherein the inert gas comprises nitrogen.

5. The method of claim 3 , wherein the inert gas is supplied at a flow rate of at least 17 m 3 /min.

6. The method of claim 1 further comprising:

providing the package workpiece on a stage, wherein the moving the package workpiece into the chamber further comprises moving the stage and the package workpiece on the stage into the chamber;

after moving the stage and the package workpiece into the chamber, closing a door of the chamber to enclose the package workpiece in the enclosed environment, wherein the setting the exhaust system at the second pressure is performed after closing the door, the second pressure being less than 5 mm H2O;

after setting the exhaust system at the second pressure, supplying an inert gas to the enclosed environment at a flow rate of at least 17 m 3 /min, the supplying the inert gas at least in part causing the oxygen content of the enclosed environment to be less than 40 ppm;

after the performing the reflow process, stopping the supplying the inert gas; and

after stopping the supply of the inert gas, opening the door of the chamber.

7. A method comprising:

moving a package workpiece into a chamber of a reflow tool, wherein gas is removed from the chamber by an exhaust system set at a first pressure during the moving the package workpiece into the chamber;

after the package workpiece is in the chamber, closing a door of the chamber;

after closing the door, supplying an inert gas to the chamber and removing gas from the chamber using the exhaust system set at a second pressure to decrease an oxygen content in the chamber, the second pressure being less than the first pressure;

while the oxygen content in the chamber is less than 40 parts per million (ppm), performing a reflow process to reflow a solder-containing material of the package workpiece; and

after performing the reflow process, stopping the supply of the inert gas.

8. The method of claim 7 , wherein the inert gas comprises nitrogen.

9. The method of claim 7 , wherein the inert gas is supplied at a flow rate of at least 17 m 3 /min.

10. The method of claim 7 , wherein the second pressure is less than 5 mm H2O.

11. The method of claim 7 , wherein moving the package workpiece into the chamber comprises receiving the package workpiece on a stage and moving the stage with the package workpiece into the chamber.

12. The method of claim 7 further comprising:

after stopping the supply of the inert gas, opening the door of the chamber; and

after opening the door, removing gas from the chamber using the exhaust system set at a pressure of greater than 15 mm H2O.

13. The method of claim 7 , wherein the performing the reflow process comprises using infrared (IR) radiation.

14. A method comprising:

providing a package workpiece on a stage;

moving the stage and the package workpiece into a chamber of a reflow tool;

during the moving the stage and the package workpiece into the chamber, removing a gas from the chamber using an exhaust set at a pressure greater than 5 mm H2O;

after moving the stage and the package workpiece into the chamber, closing a door of the chamber to enclose the package workpiece in an enclosed environment in the chamber;

after closing the door, setting the pressure of the exhaust to be less than 5 mm H2O;

after setting the pressure of the exhaust, supplying an inert gas to the enclosed environment at a flow rate of at least 17 m 3 /min, the supplying the inert gas at least in part causing an oxygen content of the enclosed environment to be less than 40 parts per million (ppm);

performing a reflow process on the package workpiece in the enclosed environment of the chamber while the oxygen content is less than 40 ppm, the reflow process reflowing a solder-containing material of the package workpiece;

after the performing the reflow process, stopping the supplying the inert gas; and

after stopping the supply of the inert gas, opening the door of the chamber.

15. The method of claim 14 , wherein the inert gas includes nitrogen, a forming gas, or a combination thereof.

16. The method of claim 14 further comprising after opening the door of the chamber, setting the pressure of the exhaust to be greater than 15 mm H2O.

17. The method of claim 14 further comprising after opening the door of the chamber, cooling the chamber comprising using a fan.

18. The method of claim 14 , wherein during the reflow process, a temperature of the enclosed environment is in a range from 40° C. to 60° C.