Ceramic elements module

1. A ceramic elements module, comprising:

ceramic elements that have a plurality of lower inserting grooves disposed on a lower surface of the ceramic elements;

an electronic component that is mounted on the lower surface of the ceramic elements; and

a heat sink that is coupled with a lower part of the ceramic elements mounted with the electronic component, and has a plurality of first penetrating holes corresponding to the plurality of lower inserting grooves and a second penetrating hole into which the electronic component is inserted,

wherein a lower surface of the electronic component is coplanar with a lower surface of the heat sink.

2. The ceramic elements module according to claim 1 , wherein the electronic component is an angle sensor.

3. The ceramic elements module according to claim 1 , wherein the plurality of lower inserting grooves and the plurality of first penetrating holes are formed in a circular shape or a rectangular shape.

4. The ceramic elements module according to claim 1 , further comprising: a fixing member that is engaged with a lower inserting groove of the plurality of lower inserting grooves through a first penetrating hole of the plurality of first penetrating holes to fix the ceramic elements to the heat sink.

5. The ceramic elements module according to claim 1 , wherein an adhering member is provided on a junction surface between the ceramic elements and the heat sink.

6. The ceramic elements module according to claim 1 , wherein the plurality of lower inserting grooves and the plurality of first penetrating holes are empty.