3DIC packages with heat dissipation structures
A package includes a first die and a second die underlying the first die and in a same first die stack as the first die. The second die includes a first portion overlapped by the first die, and a second portion not overlapped by the first die. A first Thermal Interface Material (TIM) is over and contacting a top surface of the first die. A heat dissipating lid has a first bottom surface contacting the first TIM. A second TIM is over and contacting the second portion of the second die. A heat dissipating ring is over and contacting the second TIM.
1. A package comprising:
a die stack comprising a plurality of dies;
a die underlying and bonded to the die stack, wherein the die comprises:
a first portion overlapped by the die stack; and
a second portion not overlapped by the die stack;
a first Thermal Interface Material (TIM) over and contacting a top surface of the die stack;
a second TIM over and contacting the second portion of the die;
a heat dissipating lid comprising:
a first bottom surface contacting the first TIM; and
a second bottom surface contacting the second TIM;
a package substrate, wherein the die is over and bonded to the package substrate; and
a heat dissipating ring over and adhered to the package substrate.
2. The package of claim 1 further comprising a second adhesive comprising:
a bottom surface contacting the heat dissipating ring; and
a top surface contacting the heat dissipating lid.
3. The package of claim 1 , wherein top surfaces of the heat dissipating ring and the heat dissipating lid are substantially co-planar.
4. The package of claim 1 further comprising a discrete passive device overlapped by the heat dissipating lid.
5. A package comprising:
a die stack comprising a plurality of dies;
a die underlying and bonded to the die stack, wherein the die comprises:
a first portion overlapped by the die stack; and
a second portion not overlapped by the die stack;
a first Thermal Interface Material (TIM) over and contacting a top surface of the die stack;
a second TIM over and contacting the second portion of the die; and
a heat dissipating lid comprising a recess extending from a bottom surface of the heat dissipating lid into the heat dissipating lid, wherein the die stack and the first TIM extend into the recess, and the bottom surface of the heat dissipating lid is in contact with a top surface of the second TIM, and wherein top surfaces of the heat dissipating ring and the heat dissipating lid are substantially co-planar.
6. The package of claim 5 further comprising a heat dissipating ring encircling the heat dissipating lid.
7. The package of claim 6 further comprising:
a package substrate, wherein the die is over and bonded to the package substrate;
a System-on-Chip (SoC) die over and bonded to the package substrate;
a third TIM over and contacting the SoC die; and
a first adhesive adhering the heat dissipating ring to the package substrate.
8. The package of claim 7 further comprising a second adhesive comprising:
a top surface in contact with an additional bottom surface of the heat dissipating lid; and
a bottom surface in contact with a top surface of the heat dissipating ring.
9. The package of claim 7 , wherein the heat dissipating ring encircles the SoC die.
10. The package of claim 7 further comprising a discrete passive device bonded to the package substrate, wherein the discrete passive device is overlapped by the heat dissipating lid.
11. A package comprising:
a die stack comprising a plurality of dies;
a heat dissipating lid comprising a portion encircling the die stack;
a first Thermal Interface Material (TIM) between and contacting a top surface of the die stack and a first bottom surface of the heat dissipating lid; and
a heat dissipating ring encircling the heat dissipating lid.
12. The package of claim 11 , wherein a portion of heat dissipating ring extends underlying a portion of the heat dissipating lid, and the package further comprises an adhesive comprising:
a top surface in contact with a bottom surface of the portion of the heat dissipating lid; and
a bottom surface in contact with a top surface of the portion of the heat dissipating ring.
13. The package of claim 11 further comprising:
a die underlying and bonded to the die stack; and
a second TIM comprising:
a top surface in contact with a second bottom surface of the heat dissipating lid; and
a bottom surface in contact with a top surface of the die.
14. The package of claim 13 further comprising:
a package substrate, wherein the die is over and bonded to the package substrate.
15. The package of claim 14 further comprising:
a System-on-Chip (SoC) die over and bonded to the package substrate; and
a third TIM over the SoC die and connect the SoC die to the heat dissipating ring.
16. The package of claim 1 , wherein the die comprises a high-power-consuming circuit and a low-power-consuming circuit consuming less power than the high-power-consuming circuit, and the high-power-consuming circuit is at least partially located in the second portion of the die.
17. The package of claim 16 , wherein the low-power-consuming circuit is overlapped by the die stack.
18. The package of claim 5 , wherein the die comprises a high-power-consuming circuit and a low-power-consuming circuit consuming less power than the high-power-consuming circuit, and the high-power-consuming circuit is at least partially located in the second portion of the die.
19. The package of claim 18 , wherein the low-power-consuming circuit is overlapped by the die stack.
20. The package of claim 13 , wherein the die comprises a high-power-consuming circuit and a low-power-consuming circuit consuming less power than the high-power-consuming circuit, and the high-power-consuming circuit is at least partially located in the a portion of the die un-overlapped by the die stack.