Solid-state image pickup apparatus
A solid-state image pickup apparatus including a substrate and a solid-state image pickup device. The substrate includes an opening portion. The solid-state image pickup device is mounted as a flip chip on a lower surface of the substrate on a circumference of the opening portion and receives and photo-electrically converts light that is taken in by a lens set on an upper surface of the substrate and enters from the opening portion. The circumference of the opening portion of the substrate is thinner than other portions of the substrate.
1. A solid-state image pickup apparatus, comprising:
a monolithic substrate including an opening portion;
a solid-state image pickup device that is mounted as a flip chip on a lower surface of the monolithic substrate on a circumference of the opening portion, the solid-state image pickup device being configured to receive and photo-electrically convert light that enters from the opening portion and a lens;
a seal member affixed to the opening portion of the monolithic substrate; and
a light shield member that is provided on one of a surface of the seal member opposite the solid-state image pickup device and a surface closest to the solid-state image pickup device and that shields a part of light that enters the solid-state image pickup device through the lens, wherein
the circumference of the opening portion of the monolithic substrate being thinner than any other portions of the monolithic substrate in a direction perpendicular to an upper surface of the solid-state image pickup device,
a cross-sectional surface of the circumference of the opening portion of the monolithic substrate has an L shape, and
an angle of an edge surface of the light shield member with respect to an axis perpendicular to an upper surface of the solid-state image pickup device is larger than an incident angle of light that enters an edge portion of the light shield member.
2. The solid-state image pickup apparatus according to claim 1 , wherein the seal member is affixed to the opening portion of the monolithic substrate by a resin, the seal member being configured to protect a light-receiving surface of the solid-state image pickup device, and
wherein the resin is mixed with one of a black carbon filler and pigment.
3. The solid-state image pickup apparatus according to claim 1 , wherein the angle of the edge surface of the light shield member with respect to the axis perpendicular to the solid-state image pickup device is larger than a largest incident angle of the light that enters the edge portion of the light shield member.
4. The solid-state image pickup apparatus according to claim 3 , wherein an edge surface of the opening portion does not intersect a virtual extension surface of the edge surface of the light shield member.
5. The solid-state image pickup apparatus according to claim 1 , wherein the solid-state image pickup device is a complementary metal oxide semiconductor (CMOS) device.