Semiconductor light emitting device

1. A light emitting device, comprising:

a substrate;

a light emitting element mounted on the substrate;

a light transmissive member disposed on an upper surface of the light emitting element wherein the light transmissive member is a plate-shaped member not containing a phosphor and is larger than the light emitting element when viewed from above; and

a sealing member which seals the light emitting element and the light transmissive member,

wherein the sealing member includes:

a first sealing member which is formed of a light reflecting member for reflecting light emitted from the light emitting element and covers side surfaces of the light emitting element; and

a second sealing member which contains a phosphor for converting the light emitted from the light emitting element into light having a wavelength different from a wavelength of the light emitted from the light emitting element and covers at least an upper surface of the light transmissive member,

wherein the second sealing member covers at least a part of a lower surface of an outer extended part of the light transmissive member which extends out of the light emitting element when viewed from above, and

wherein the first sealing member covers an upper surface of the substrate.

2. The light emitting device according to claim 1 , wherein

the second sealing member covers side surfaces of the light transmissive member.

3. The light emitting device according to claim 1 wherein

the second sealing member comprises a resin material.

4. The light emitting device according to claim 2 , wherein

the second sealing member comprises a resin material.

5. The light emitting device according to claim 3 , wherein

the first sealing member covers the upper surface of the substrate, and

the phosphor is deposited, in the second sealing member, on the upper surface of the light transmissive member and on a boundary surface between the second sealing member and the first sealing member.

6. The light emitting device according to claim 4 , wherein

the first sealing member covers the upper surface of the substrate, and

the phosphor is deposited, in the second sealing member, on the upper surface of the light transmissive member and on a boundary surface between the second sealing member and the first sealing member.

7. A method for manufacturing a light emitting device, the method comprising steps of:

(1) mounting a light emitting element on a substrate;

(2) placing a plate-shaped light transmissive member on an upper surface of the light emitting element, the plate-shaped light transmissive member being larger than the light emitting element when viewed from above;

(3) covering side surfaces of the light emitting element with a first sealing member formed of a light reflecting member which reflects light emitted from the light emitting element; and

(4) covering, after steps (2) and (3), at least an upper surface of the light transmissive member with a second sealing member containing a phosphor for converting light emitted from the light emitting element into light having a wavelength different from a wavelength of the light emitted from the light emitting element, wherein the first sealing member comprises a resin material, and

wherein step (3) includes steps of:

dropping a liquid resin material before being cured;

curing the liquid resin material to form the first sealing member; and

wherein step (3) is performed before step (2).

8. The light emitting device according to claim 1 , wherein the light emitting element comprises a plurality of light emitting elements.

9. The light emitting device according to claim 8 , wherein a space is disposed between edges of adjacent ones of the plurality of light emitting elements, and wherein the space is filled with light reflecting material.

10. The light emitting device according to claim 8 , further comprising a frame member surrounding the plurality of light emitting elements and the light transmissive member.

11. A light emitting device, comprising:

a substrate;

a light emitting element mounted on the substrate, said light emitting element having a first planar dimension;

a light transmissive member disposed on an upper surface of the light emitting element, said light transmissive member having a second planar dimension larger than the first planar dimension, and comprising a plate-shaped member not containing a phosphor; and

a sealing member which seals the light emitting element and the light transmissive member,

wherein the sealing member comprises a first sealing member which is formed of a light reflecting member for reflecting light emitted from the light emitting element, and which covers side surfaces of the light emitting element, and a second sealing member which contains a phosphor for converting the light emitted from the light emitting element into light having a wavelength different from a wavelength of the light emitted from the light emitting element, and which covers at least an upper surface of the light transmissive member,

wherein the second sealing member covers at least a part of a lower surface of an outer extended part of the light transmissive member which extends out of the light emitting element when viewed from above, and

wherein the first sealing member covers an upper surface of the substrate.