IP Library Granted Patent US 9,385,244
Granted Patent B2
US 9,385,244 · App. 14/617,111 · Granted Jul 5, 2016

Wide bandgap semiconductor device

Inventor: Noriyuki Hirakata (Osaka, JP)
Assignee: Sumitomo Electric Industries, Ltd.
H01L29/872H01L29/0619H01L29/0688H01L29/0692H01L29/1608H01L29/36H01L29/6606
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Quick Facts
Patent No.
US 9,385,244
App. No.
14/617,111
Granted
Jul 5, 2016
Kind
B2
Abstract

A wide bandgap semiconductor device includes a wide bandgap semiconductor layer and a Schottky electrode. The wide bandgap semiconductor layer includes a first impurity region which is in contact with the Schottky electrode, is in contact with a second main surface, and has a first conductivity type, and a second impurity region which is in contact with the Schottky electrode, is in contact with the first impurity region, and has a second conductivity type. The second impurity region has a first region which is in contact with the Schottky electrode, and a second region which is connected with the first region and provided on a side of the first region closer to the second main surface. A maximum value of a width of the second region is larger than a width of a boundary portion between the first region and the Schottky electrode.

Claims (37)

1. A wide bandgap semiconductor device, comprising:

a wide bandgap semiconductor layer having a first main surface and a second main surface opposite to said first main surface; and

a Schottky electrode in contact with said first main surface of said wide bandgap semiconductor layer, wherein

said wide bandgap semiconductor layer includes a first impurity region which is in contact with said Schottky electrode at said first main surface, is in contact with said second main surface, and has a first conductivity type, and a second impurity region which is in contact with said Schottky electrode at said first main surface, is in contact with said first impurity region, and has a second conductivity type different from said first conductivity type,

said second impurity region has a first region which is in contact with said Schottky electrode at said first main surface, and a second region which is connected with said first region and provided on a side of said first region closer to said second main surface,

when viewed in a cross sectional view, a maximum value of a width of said second region along a direction parallel to said first main surface is larger than a width of a boundary portion between said first region and said Schottky electrode, and

said second region has a first surface portion which faces said first main surface, and a second surface portion which is opposite to said first surface portion and faces said second main surface, and

said first region is provided to extend from a portion of said first surface portion of said second region to said first main surface.

2. The wide bandgap semiconductor device according to claim 1 , wherein, when viewed in a plan view, an area of said boundary portion is smaller than an area of said second surface portion of said second region.

3. The wide bandgap semiconductor device according to claim 1 , wherein an impurity concentration of said first region is higher than an impurity concentration of said second region.

4. The wide bandgap semiconductor device according to claim 1 , wherein, when viewed in a plan view, said first region has an island shape.

5. The wide bandgap semiconductor device according to claim 1 , wherein, when viewed in a plan view, said second region has a stripe shape.

6. The wide bandgap semiconductor device according to claim 1 , wherein

said first region has a plurality of first region portions, and

when viewed in a plan view, said plurality of first region portions are provided along both a first direction parallel to said first main surface and a second direction parallel to said first main surface and perpendicular to said first direction.

7. The wide bandgap semiconductor device according to claim 1 , wherein said wide bandgap semiconductor layer includes silicon carbide.

8. The wide bandgap semiconductor device according to claim 1 , wherein

said second region includes a plurality of second region portions, and

said wide bandgap semiconductor layer further includes a third impurity region which is provided between said plurality of second region portions, has said first conductivity type, and has an impurity concentration higher than an impurity concentration of said first impurity region.

9. The wide bandgap semiconductor device according to claim 8 , wherein said third impurity region is spaced from each of said plurality of second region portions.

10. A wide bandgap semiconductor device, comprising:

a wide bandgap semiconductor layer having a first main surface and a second main surface opposite to said first main surface; and

a Schottky electrode in contact with said first main surface of said wide bandgap semiconductor layer, wherein

said wide bandgap semiconductor layer includes a first impurity region which is in contact with said Schottky electrode at said first main surface, is in contact with said second main surface, and has a first conductivity type, and a second impurity region which is in contact with said Schottky electrode at said first main surface, is in contact with said first impurity region, and has a second conductivity type different from said first conductivity type,

said second impurity region has a first region which is in contact with said Schottky electrode at said first main surface, and a second region which is connected with said first region and provided on a side of said first region closer to said second main surface,

when viewed in a cross sectional view, a maximum value of a width of said second region along a direction parallel to said first main surface is larger than a width of a boundary portion between said first region and said Schottky electrode,

said second region includes a plurality of second region portions, and

said wide bandgap semiconductor layer further includes a third impurity region which is provided between said plurality of second region portions, has said first conductivity type, and has an impurity concentration higher than an impurity concentration of said first impurity region.

11. The wide bandgap semiconductor device according to claim 10 , wherein, when viewed in a plan view, an area of said boundary portion is smaller than an area of said second surface portion of said second region.

12. The wide bandgap semiconductor device according to claim 10 , wherein an impurity concentration of said first region is higher than an impurity concentration of said second region.

13. The wide bandgap semiconductor device according to claim 10 , wherein, when viewed in a plan view, said first region has an island shape.

14. The wide bandgap semiconductor device according to claim 10 , wherein, when viewed in a plan view, said second region has a stripe shape.

15. The wide bandgap semiconductor device according to claim 10 , wherein

said first region has a plurality of first region portions, and

when viewed in a plan view, said plurality of first region portions are provided along both a first direction parallel to said first main surface and a second direction parallel to said first main surface and perpendicular to said first direction.

16. The wide bandgap semiconductor device according to claim 10 , wherein said wide bandgap semiconductor layer includes silicon carbide.

17. The wide bandgap semiconductor device according to claim 10 , wherein said third impurity region is spaced from each of said plurality of second region portions.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 9, 2015
From: HIRAKATA, NORIYUKI
To: SUMITOMO ELECTRIC INDUSTRIES, LTD.
Reel/Frame 034918/0652 →
Priority Claims (1)
JP 2014-047806 · Mar 11, 2014 · national
Continuity (1)
Related Publication 20150263180A1 · Sep 17, 2015