IP Library Granted Patent US 9,389,063
Granted Patent B2
US 9,389,063 · App. 14/245,638 · Granted Jul 12, 2016

Chip-scale interferometry for hyperentanglement processing

Inventors: Chee Wei Wong (Weehawken, NJ); Franco N. C. Wong (Lexington, MA); Dirk R. Englund (New York, NY)
Assignee: The Trustees Of Columbia University In The City Of New York
G01B9/02G02F1/39G06N99/002G02B6/126Y10T29/49
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Quick Facts
Patent No.
US 9,389,063
App. No.
14/245,638
Granted
Jul 12, 2016
Kind
B2
Abstract

An interferometer module for quantum processing is described including a substrate having two or more input ports and two or more output ports; multiple photonic pathways embedded in the substrate for conveying photons from the two or more input ports and the two or more output ports; and one or more partial beam splitters embedded in the substrate in a photonic pathway for generating spatial and polarization entanglement.

Claims (46)

1. An interferometer module for quantum processing comprising:

a substrate comprising two or more input ports and two or more output ports;

multiple photonic pathways embedded in the substrate for conveying photons from the two or more input ports and the two or more output ports;

two spatially entangled photon sources and one or more partial beam splitters for orthogonally polarizing the outputs of the spatially entangled photon sources wherein the one or more partial beam splitters is embedded in the substrate in a photonic pathway for generating spatial and polarization entanglement, and further wherein the module is a hyperentanglement generation module.

2. The interferometer module of claim 1 , further comprising a halfwave plate embedded in the substrate in a photonic pathway for rotating polarization by 45 degrees.

3. The interferometer module of claim 2 , wherein the halfwave plate is a polarization rotator fabricated on the substrate.

4. The interferometer module of claim 1 , wherein one or more partial beam splitters is 50/50 beam splitter.

5. The interferometer module of claim 1 , wherein the partial beam splitter is a coupling region fabricated on the substrate.

6. The interferometer module of claim 1 , wherein the multiple photonic pathways define at least one interference crossing.

7. The interferometer module of claim 1 , wherein the module is a hyperentanglement analysis module.

8. The interferometer module of claim 7 , wherein the input ports comprise a signal photon input.

9. The interferometer module of claim 7 wherein the partial beam splitter comprises a 50/50 beam splitter for polarization analysis along the (H, V) basis and the (H+V, H−V) basis.

10. The interferometer module of claim 7 , wherein the partial beam splitter comprises a 50/50 beam splitter to randomly select the spatial mode analysis basis.

11. The interferometer module of claim 10 , further comprising two detectors to determine the (T, B) basis of the spatial mode analysis.

12. The interferometer module of claim 10 , further comprising a 50/50 beam splitter to mix two T and B spatial modes to generate T+B and T−B states to determine the (T+B, T−B) basis of the spatial mode analysis.

13. The interferometer module of claim 1 , wherein the substrate has a maximum dimension of 10 centimeters or less in length and is fabricated on one or more semiconductor wafers.

14. The interferometer module of claim 1 , wherein the substrate is fabricated from integrated photonic semiconductor materials.

15. The interferometer module of claim 1 , wherein the photonic pathway is fabricated from integrated photonic semiconductor materials through lithography or pattern transfer processes.

16. A method for fabricating an interferometer module for quantum processing comprising:

providing a substrate comprising two or more input ports and two or more output ports;

providing multiple photonic pathways embedded in the substrate for conveying photons from the two or more input ports and the two or more output ports;

providing one or more partial beam splitters embedded in the substrate in a photonic pathway for generating spatial and polarization entanglement; and

providing two spatially entangled photon sources and a partial beam splitter for orthogonally polarizing the outputs of the spatially entangled photon sources, wherein the module is a hyperentanglement generation module.

17. The method of claim 16 , further comprising providing a halfwave plate embedded in the substrate in a photonic pathway for rotating polarization by 45 degrees.

18. The method of claim 17 , wherein providing the halfwave plate comprises providing a polarization rotator fabricated on the substrate.

19. The method of claim 16 , wherein providing the partial beam splitter comprises providing a 50/50 beam splitter.

20. The method of claim 19 , wherein providing the partial beam splitter comprises providing a coupling region fabricated on the substrate.

21. The method of claim 16 , wherein providing the multiple photonic pathways comprises defining at least one interference crossing.

22. The method of claim 16 , wherein the module is a hyperentanglement analysis module.

23. The method of claim 22 , wherein providing an input port comprises providing a signal photon input.

24. The method of claim 22 , wherein providing the partial beam splitter comprises providing a 50/50 beam splitter for polarization analysis along the (H, V) basis and the (H+V, H−V) basis.

25. The method of claim 22 , wherein providing the partial beam splitter comprises providing a 50/50 beam splitter to randomly select the spatial mode analysis basis.

26. The method of claim 22 , further comprising providing two detectors to determine the (T, B) basis of the spatial mode analysis.

27. The method of claim 22 , further comprising providing a 50/50 beam splitter to mix two T and B spatial modes to generate T+B and T−B states to determine the (T+B, T−B) basis of the spatial mode analysis.

28. The method of claim 16 , wherein providing the substrate comprises providing the substrate having a dimension of 10 centimeters or less and fabricated on one or more semiconductor wafer.

29. The method of claim 16 , wherein providing the substrate comprises providing the substrate fabricated from integrated photonic semiconductor materials.

30. The method of claim 16 , wherein providing the photonic pathway comprises providing photonic pathways fabricated from integrated photonic semiconductor materials through lithography or pattern transfer processes.

31. An interferometer module for quantum processing comprising:

a substrate comprising two or more input ports and two or more output ports;

multiple photonic pathways embedded in the substrate for conveying photons from the two or more input ports and the two or more output ports;

a partial beam splitters embedded in the substrate in a photonic pathway for generating spatial and polarization entanglement, wherein the partial beam splitters comprises a 50/50 beam splitter to randomly select the spatial mode analysis basis; and

two detectors to determine the (T, B) basis of the spatial mode analysis, wherein the module is a hyperentanglement analysis module.

32. The interferometer module of claim 31 , wherein the 50/50 beam splitter is configured to mix two T and B spatial modes to generate T+B and T−B states to determine the (T+B, T−B) basis of the spatial mode analysis.

33. The interferometer module of claim 31 , wherein the substrate has a maximum dimension of 10 centimeters or less in length and is fabricated on one or more semiconductor wafers.

34. The interferometer module of claim 31 , wherein the substrate is fabricated from integrated photonic semiconductor materials.

35. The interferometer module of claim 31 , wherein the photonic pathway is fabricated from integrated photonic semiconductor materials through lithography or pattern transfer processes.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 15, 2015
From: WONG, CHEE WEI; WONG, FRANCO N.C.
To: THE TRUSTEES OF COLUMBIA UNIVERSITY IN THE CITY OF NEW YORK
Reel/Frame 035413/0107 →
Continuity (3)
Continuation PCTUS2012059109 · Oct 5, 2012
Provisional Application 61543508 · Oct 5, 2011
Related Publication 20140218747A1 · Aug 7, 2014