IP Library › Granted Patent US 9,389,127
Granted Patent B2
US 9,389,127 · App. 13/612,656 · Granted Jul 12, 2016

Semiconductor device and temperature sensor system

Inventors: Tadashi Kameyama (Kanagawa, JP); Takanobu Naruse (Kanagawa, JP); Takayasu Ito (Kanagawa, JP)
Assignee: Renesas Electronics Corporation
G01K7/01G01K1/00G01K15/00G01K7/00
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,389,127
App. No.
13/612,656
Granted
Jul 12, 2016
Kind
B2
Abstract

A temperature sensor in a semiconductor device includes a temperature detection circuit for outputting a voltage according to the chip temperature, a reference voltage generating circuit for generating a plurality of reference voltages, and a plurality of voltage comparators for comparing each reference voltage with an output voltage of the temperature detection circuit and thereby generating a chip temperature detection signal configured with multiple bits. Further, the temperature sensor includes a control circuit for controlling the reference voltages generated by the reference voltage generating circuit based on the chip temperature detection signal and thereby changing correspondence between the chip temperature detection signal and the chip temperature to shift a chip temperature detection range. It is possible to expand the chip temperature detection range by changing the correspondence between the chip temperature detection signal and the chip temperature, without increasing the number of voltage comparators.

Claims (31)

1. A semiconductor device comprising:

a temperature sensor for detecting a chip temperature; and

a module whose operation can be controlled based on an output of the temperature sensor,

wherein the temperature sensor comprises:

a temperature detection circuit for outputting a voltage signal according to the chip temperature;

a reference voltage generating circuit for generating a plurality of reference voltage signals;

a plurality of voltage comparators for comparing each reference voltage signal of the reference voltage generating circuit with the voltage signal of the temperature detection circuit and thereby generating a chip temperature detection signal configured with multiple bits; and

a control circuit receiving the chip temperature detection signal with multiple bits and changing the reference voltages generated by the reference voltage generating circuit based directly on the received chip temperature detection signal with multiple bits, thereby changing correspondence between the chip temperature detection signal with multiple bits and the chip temperature, so as to shift a chip temperature detection range,

wherein the control circuit changes the reference voltage signals so that portions of chip temperature detection ranges overlap each other around the shift of the chip temperature detection range.

2. The semiconductor device according to claim 1 , wherein the control circuit comprises:

a first register for holding a reference voltage control signal for controlling the reference voltages; and

a second register for holding the chip temperature detection signal.

3. The semiconductor device according to claim 2 , wherein the control circuit comprises a third register for outputting the reference voltage control signal and the chip temperature detection signal to the outside of the temperature sensor.

4. The semiconductor device according to claim 3 ,

wherein the reference voltage generating circuit comprises:

a plurality of resistors for dividing an input voltage; and

a switch for selecting a resistor concerned in the division of the input voltage from among the resistors.

5. The semiconductor device according to claim 4 , wherein the control circuit comprises a switch control circuit which increments or decrements a switch control signal for controlling an operation of the switch based on the chip temperature detection signal held in the second register.

6. The semiconductor device according to claim 5 , wherein the switch control circuit has a mask function for fixing a logic value of the signal sent from the second register only during a predetermined mask period, and increments or decrements the switch control signal during the mask period.

7. The semiconductor device according to claim 6 , wherein the module comprises a first module which receives the reference voltage control signal and the chip temperature detection signal through the third register and can trim an internal circuit based on the reference voltage control signal and the chip temperature detection signal.

8. The semiconductor device according to claim 7 ,

wherein the control circuit comprises a low-temperature operation signal generating circuit for generating a low-temperature operation signal based on the reference voltage control signal and the chip temperature detection signal, and

wherein the module comprises a second module which can perform a dummy operation for generating heat, in accordance with the low-temperature operation signal.

9. The semiconductor device according to claim 8 , wherein the module comprises a CPU which receives the reference voltage control signal and the chip temperature detection signal through the third register, generates a predetermined interrupt signal based on the reference voltage control signal and the chip temperature detection signal, and can perform control for decreasing an operation rate in the semiconductor device in accordance with the interrupt signal.

10. The semiconductor device according to claim 9 , wherein the temperature sensor comprises a reference voltage adjustment circuit for fine-adjusting the reference voltages generated by the reference voltage generating circuit in accordance with a signal provided from the outside of the temperature sensor.

11. A temperature sensor system for detecting a chip temperature of a semiconductor device, the temperature sensor system comprising:

a temperature detection circuit for outputting a voltage signal according to the chip temperature;

a reference voltage generating circuit for generating a plurality of reference voltage signals;

a plurality of voltage comparators comparing each reference voltage signal of the reference voltage generating circuit with the voltage signal of the temperature detection circuit and thereby generating a chip temperature detection signal configured with multiple bits; and

a control circuit receiving the chip temperature detection circuit with multiple bits, and changing the reference voltage signals generated by the reference voltage generating circuit based directly on the received chip temperature detection signal with multiple bits, thereby changing correspondence between the chip temperature detection signal with multiple bits and the chip temperature to shift a chip temperature detection range,

wherein the control circuit changes the reference voltage signals so that portions of chip temperature detection ranges overlap each other around the shift of the chip temperature detection range.

Assignments (2)
CHANGE OF ADDRESS Recorded Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2012
From: KAMEYAMA, TADASHI; NARUSE, TAKANOBU; ITO, TAKAYASU
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 028968/0105 →
Priority Claims (1)
JP 2011-204243 · Sep 20, 2011 · national
Continuity (1)
Related Publication 20130073240A1 · Mar 21, 2013