Gas flow profile modulated control of overlay in plasma CVD films
Methods for modulating local stress and overlay error of one or more patterning films may include modulating a gas flow profile of gases introduced into a chamber body, flowing gases within the chamber body toward a substrate, rotating the substrate, and unifying a center-to-edge temperature profile of the substrate by controlling the substrate temperature with a dual zone heater. A chamber for depositing a film may include a chamber body comprising one or more processing regions. The chamber body may include a gas distribution assembly having a blocker plate for delivering gases into the one or more processing regions. The blocker plate may have a first region and a second region, and the first region and second region each may have a plurality of holes. The chamber body may have a dual zone heater.
1. A method of modulating local stress and overlay error of one or more patterning films, comprising:
modulating a gas flow profile of gases via a blocker plate comprising a first region and a second region, wherein the first region and second region each have a plurality of holes, wherein the plurality of holes of the first region are spaced more closely relative to one another than the plurality of holes of the second region;
introducing the gases into a chamber body through the holes of the first region of the blocker plate and the second region of the blocker plate;
flowing the gases within the chamber body toward a first region and a second region of a substrate; and
rotating the substrate after deposition of at least a partial film onto the substrate.
2. The method of claim 1 , further comprising:
unifying a center-to-edge temperature profile of the substrate by controlling the substrate temperature with a dual zone heater, wherein the dual zone heater comprises a first heating zone and a second heating zone, wherein the second heating zone circumscribes the first heating zone, and wherein a temperature of the first heating zone is different than a temperature of the second heating zone.
3. The method of claim 1 , further comprising:
monitoring film morphology across one or more of the patterning films with a metrology tool.
4. The method of claim 1 , wherein rotating the substrate is performed ex-situ.
5. The method of claim 1 , wherein the first region of the blocker plate is a center region and the second region of the blocker plate is an edge region.
6. The method of claim 1 , wherein the substrate is rotated while supported by a shadow ring.
7. The method of claim 1 , wherein the substrate is rotated 180° .
8. The method of claim 1 , wherein a pressure within the chamber body is about 0.4T to about 10 T.
9. The method of claim 1 , further comprising applying an RF voltage to a showerhead.
10. The method of claim 1 , wherein the gases comprise one or more carrier gases selected from the group consisting of helium, argon, carbon dioxide, and combinations thereof.
11. The method of claim 10 , wherein a flow rate of the carrier gas is between about 500 sccm to about 1,500 sccm.
12. The method of claim 1 , wherein the gases comprise an oxidizing gas selected from the group consisting of O 2 , O 3 , N 2 O, CO, and carbon dioxide.
13. The method of claim 12 , wherein a flow rate of the oxidizing gas is between about 100 sccm to about 3,000 sccm.
14. The method of claim 1 , wherein the gases comprise a hydrocarbon compound.
15. The method of claim 14 , wherein a ratio of molar flow of diluent gas to molar flow rate of hydrocarbon gas is between about 2:1 and about 40:1.
16. The method of claim 14 , wherein the hydrocarbon compound is a nitrogen-containing hydrocarbon, a fluorine-containing hydrocarbon, an oxygen-containing hydrocarbon, a hydroxyl-containing hydrocarbon, or a boron-containing hydrocarbon.
17. The method of claim 1 , wherein the gases comprise krypton, xenon, or argon.
18. The method of claim 2 , wherein the temperature of the first heating zone and the temperature of the second heating zone are maintained between about 100° C. and about 650° C.
19. The method of claim 1 , wherein the modulating a gas flow profile of gases is further carried out via a showerhead comprising a first region and a second region, wherein the first region and second region each have a plurality of holes, wherein the first region comprises a higher density of the plurality of holes than a density of the plurality of holes of the second region.
20. The method of claim 1 , further comprising:
unifying a center-to-edge temperature profile of the substrate by controlling the substrate temperature with a dual zone heater, wherein the dual zone heater comprises a first heating zone and a second heating zone, and wherein the second heating zone circumscribes the first heating zone.