Multi-layer printed circuit boards having properties suitable for layer reduction design
A multi-layer printed circuit board comprises: at least two insulation layers, respectively having glass fiber cloth and cured resin covering thereon, the insulation layers being stacked on each other; an internal trace layer formed between two neighboring insulation layers; and an external trace layer formed on an outer surface of the outermost insulation layer; wherein the insulation layers have a dielectric constant of 3.4 or less, and the internal and external trace layers have a trace width between 40 and 75 micrometers, such that the multi-layer printed circuit board has a characteristic impedance between 45 and 55Ω in single-ended signaling and between 90 and 110Ω in differential signaling.
1. A multi-layer printed circuit board comprising:
at least two insulation layers, respectively having glass fiber cloth and cured resin covering thereon, the at least two insulation layers being stacked on top of each other;
an internal trace layer formed between two neighboring ones of the at least two insulation layers; and
an external trace layer formed on the outer surface of an outermost one of the at least two insulation layers;
wherein the at least two insulation layers have a dielectric constant of 3.4 or less, and the internal, and external trace layers have a trace width between 40 and 75 micrometers, such that the multi-layer printed circuit board has a characteristic impedance between 45 and 55Ω in single-ended signaling and between 90 and 110Ω in differential signaling; and wherein the dielectric constant of the at least two insulation layers is measured at a resin content of 75% and a frequency of 2 GHz.
2. The multi-layer printed circuit board of claim 1 , wherein the characteristic impedance is measured in accordance with methods specified in IPC-TM-650 2.5.5.7.
3. The multi-layer printed circuit board of claim 1 , wherein the glass fiber cloth as a dielectric constant of less than 6.6 at a frequency of 1 GHz to 10 GHz.
4. The multi-layer printed circuit board of claim 1 , wherein the dielectric constant of the at least two insulation layers is 3.2 or less at the resin content of 75% and the frequency of 2 GHz.
5. The multi-layer printed circuit board of claim 1 , wherein the dielectric constant of the insulation layers is measured in accordance with methods specified in JIS C2565.
6. The multi-layer printed circuit board of claim 1 , wherein the trace width of the internal and external trace layers is between 40 and 60 micrometers.
7. The multi-layer printed circuit board of claim 1 , wherein the trace width of the internal and external trace layers is between 45 and 55 micrometers.
8. The multi-layer printed circuit. board of claim 1 , wherein the characteristic impedance is about 50Ω in single-ended signaling and about 100Ω in differential signaling.
9. The multi-layer printed circuit board of claim 1 , wherein the insulation layers are prepared by impregnating the glass fiber cloth in a resin composition followed by heating and lamination, and wherein the resin composition comprises any one of polyphenylene oxide, polyaniline, polyester, polybutadiene, styrene-butadiene copolymer, styrene maleic anhydride, maleimide, cyanate ester, isocyanutrate, epoxy resin, polytetrafluoroethylene, benzoxazine, vinyl compound, and a combination thereof.