Interconnecting conduction structure for electrically connecting conductive traces of flexible circuit boards
An interconnecting conduction structure for electrically connecting conductive traces of a lapped flexible circuit board is disclosed. The lapped flexible circuit board includes a first flexible circuit board and a second flexible circuit board. A through hole is formed in the second flexible circuit board and an interconnecting conduction member is filled in the through hole of the second flexible circuit board. The interconnecting conduction member is electrically connected to a second solder pad of the second flexible circuit board and a first solder pad of the first flexible circuit board in order to formed a lapped connection between conductive traces of the first flexible circuit board and the second flexible circuit board.
1. An interconnecting conduction structure for conductive traces of a lapped flexible circuit board, comprising:
a first flexible circuit board, which includes a first substrate, the first substrate defining a first stacking section and having at least one first solder pad formed in the first stacking section;
a second flexible circuit board, which includes a second substrate, the second substrate defining a second stacking section and having at least one second solder pad formed in the second stacking section;
at least one through opening is formed in the second stacking section of the second flexible circuit board, the through opening being formed by a hole extending through the second solder pad and a hole extending through the second substrate, wherein a diameter of the hole extending through the second substrate is greater than a diameter of the hole extending through the second solder pad, and a portion of the second solder pad overlays the hole extending through the second substrate; wherein the second stacking section of the second flexible circuit board is set overlapping the first stacking section of the first flexible circuit board and the through opening corresponds in position to the first solder pad of the first flexible circuit board;
an interconnecting conduction member filled in the through-opening to electrically connect the second solder pad of the second flexible circuit board to the first solder pad of the first flexible circuit board, the interconnecting conduction member surrounds the portion of the second solder pad overlaying the hole extending through the second substrate; and,
an insulation layer formed on the first substrate, the insulation layer having a hole formed therethrough corresponding in position to the through opening, a diameter of the hole extending through the insulation layer being greater than the diameter of the hole extending through the second substrate, the interconnecting conduction member filling the hole in the insulation layer.
2. The interconnecting conduction structure as claimed in claim 1 , wherein the first solder pad of the first flexible circuit board is electrically connected to at least one first conductive trace laid on the first substrate.
3. The interconnecting conduction structure as claimed in claim 2 , wherein the first conductive trace comprises one of a power trace, a grounding trace, and a signal transmission trace.
4. The interconnecting conduction structure as claimed in claim 1 , wherein the second solder pad of the second flexible circuit board is electrically connected to at least one second conductive trace laid on the second substrate.
5. The interconnecting conduction structure as claimed in claim 4 , wherein the second conductive trace comprises one of a power trace, a grounding trace, and a signal transmission trace.
6. The interconnecting conduction structure as claimed in claim 1 , wherein the second substrate comprises at least one third conductive trace formed on a surface thereof opposite to the second conductive trace.
7. The interconnecting conduction structure as claimed in claim 1 , wherein the interconnecting conduction member comprises one of silver, aluminum, copper, tin, a conductive carbon paste, a conductive particle paste layer.
8. The interconnecting conduction structure as claimed in claim 1 , wherein an insulation layer is further formed on a surface of the interconnecting conduction member.
9. The interconnecting conduction structure as claimed in claim 1 , wherein the first flexible circuit board and the second flexible circuit board are each one of a single-sided board, a double-sided board, a multiple-layered board, and a rigid-flex board.
10. The interconnecting conduction structure as claimed in claim 1 , wherein the hole extending through the second substrate has a hole wall conductive layer formed thereon.
11. The interconnecting conduction structure as claimed in claim 1 , wherein the hole extending through the second substrate is shaped in the form of one of a circle, a rectangle, and a square.