Apparatus and methods using heat pipes for linking electronic assemblies that unequally produce heat

1. An apparatus comprising:

at least one heat sink;

first and second electronic assemblies mounted on the at least one heat sink at respective first and second mounting sites, wherein the first and second electronic assemblies are components of respective subsystems of a UPS; and

at least one heat pipe thermally coupled to the at least one heat sink, each of the at least one heat pipe having first and second portions disposed proximate respective ones of the first and second mounting sites, wherein the first and second electronic assemblies are configured to generate heat in an at least partially non-concurrent manner such that heat is transferred between the first and second mounting sites through the at least one heat pipe in different directions at different times.

2. The apparatus of claim 1 ,

wherein the at least one heat sink comprises separate first and second heat sinks;

wherein the first and second electronic assemblies are mounted on respective ones of the first and second heat sinks; and

wherein the at least one heat pipe thermally couples the first and second heat sinks.

3. The apparatus of claim 2 , wherein the at least one heat pipe comprises a plurality of parallel heat pipes.

4. The apparatus of claim 2 , wherein the first and second heat sinks each comprise a base having a side upon which the respective first and second electronic assemblies are mounted and a plurality of fins extending from a second side of the base, wherein the first and second heat sinks are positioned such that the fins thereof face one another, and wherein the at least one heat pipe passes between the bases of the first and second heat sinks.

5. The apparatus of claim 1 ,

wherein the at least one heat sink comprises first and second base plates and a plurality of fins extending between the first and second base plates;

wherein the first and second electronic assemblies are mounted on respective ones of the first and second base plates on sides thereof opposite the fins; and

wherein the at least one heat pipe thermally couples the first and second base plates.

6. The apparatus of claim 1 , wherein the at least one heat sink comprises a single heat sink and wherein the first and second electronic assemblies are mounted at spaced apart locations on the single heat sink.

7. The apparatus of claim 6 , wherein the first and second electronic assemblies are spaced apart along a direction and wherein the at least one heat pipe runs along the same direction.

8. The apparatus of claim 7 , wherein the at least one heat pipe comprises a plurality of parallel heat pipes.

9. The apparatus of claim 1 , wherein the first and second electronic assemblies comprise respective components of first and second power converter circuit assemblies.

10. The apparatus of claim 9 , wherein the components comprise respective first and second power semiconductor devices.

11. An uninterruptible power supply (UPS) comprising:

a plurality of UPS subsystems comprising at least two of a rectifier circuit, an inverter circuit, a battery converter circuit and a bypass circuit;

at least one heat sink having respective first and second components of respective ones of first and second subsystems of the plurality of UPS subsystems, the first and second components mounted on the at least one heat sink at respective first and second mounting sites; and

at least one heat pipe thermally coupled to the at least one heat sink, each of the at least one heat pipe having first and second portions disposed proximate respective ones of the first and second mounting sites, wherein the first and second components pipe generate heat in an at least partially non-concurrent manner such that heat is transferred between the first and second mounting sites through the at least one heat pipe in different directions at different times.

12. The UPS of claim 11 , wherein the first and second components comprise respective first and second power semiconductor devices.

13. The UPS of claim 11 ,

wherein the at least one heat sink comprises separate heat sink bases;

wherein the first and second power semiconductor devices are mounted on respective ones of the heat bases; and

wherein the at least one heat pipe thermally couples the first and second heat sink bases.

14. The UPS of claim 11 , wherein the at least one heat sink comprises a single heat sink and wherein the first and second power semiconductor devices are mounted at spaced apart locations on the single heat sink.

15. The UPS of claim 14 , wherein the first and second power semiconductor devices are spaced apart along a direction and wherein the at least one heat pipe runs along the same direction.

16. The UPS of claim 11 , wherein the first and second components comprise a component of the rectifier circuit and a component of the battery converter circuit, respectively.

17. The UPS of claim 11 , wherein the first and second components comprise a component of the inverter circuit and a component of the bypass circuit, respectively.

18. A method comprising:

mounting first and second power semiconductor devices at respective first and second mounting sites of at least one heat sink having at least one heat pipe thermally coupled thereto, each of the at least one heat pipe having first and second portions disposed proximate respective ones of the first and second mounting sites, wherein the first and second power semiconductor devices are components of respective subsystems of a UPS; and

operating the first and second power semiconductor devices such that they generate heat in an at least partially non-concurrent manner to cause heat to be transferred between the first and second mounting sites through the at least one heat pipe in different directions at different times.

19. The method of claim 18 , wherein the at least one heat sink comprises separate first and second heat sinks, wherein the at least one heat pipe thermally couples the first and second heat sinks and wherein mounting the first and second power semiconductor devices comprises mounting the first and second power semiconductor devices on respective ones of the first and second heat sinks.

20. The method of claim 18 , wherein the at least one heat sink comprises first and second base plates and a plurality of fins extending between the first and second base plates, wherein the at least one heat pipe thermally couples the first and second base plates, and wherein mounting the first and second power semiconductor devices comprises mounting the first and second electronic assemblies are mounted on respective ones of the first and second base plates on sides thereof opposite the fins.

21. The method of claim 18 , wherein the at least one heat sink comprises a single heat sink and wherein mounting the first and second power semiconductor devices comprises mounting the first and second power semiconductor devices at spaced apart locations on the single heat sink.