Semiconductor module and power converter
A semiconductor module includes a case, a semiconductor component provided in the case for switching a current, encapsulating resin provided in the case for covering the semiconductor component, a magnetic shield contacting the encapsulating resin and containing a magnetic material, and an embedded magnetic shield embedded in the case, the embedded magnetic shield containing a magnetic material.
1. A semiconductor module comprising:
a case;
a semiconductor component provided in the case for switching a current;
encapsulating resin provided in the case for covering the semiconductor component;
a magnetic shield contacting the encapsulating resin and containing a magnetic material; and
an embedded magnetic shield embedded in the case so as to be surrounded by the case on all sides, the embedded magnetic shield containing a magnetic material.
2. The semiconductor module according to claim 1 , wherein the magnetic shield is formed on whole of an upper surface of the encapsulating resin.
3. The semiconductor module according to claim 1 , wherein the embedded magnetic shield surrounds side surfaces of the semiconductor component.
4. The semiconductor module according to claim 1 , wherein the embedded magnetic shield is provided on a lower surface side of the semiconductor component.
5. The semiconductor module according to claim 1 , further comprising:
a control circuit board provided above the magnetic shield in the case; and
an electronic component fixed to the control circuit board.
6. A semiconductor module comprising:
a case;
a high-power semiconductor component provided in the case for switching a current;
encapsulating resin provided in the case for covering the semiconductor component;
a magnetic shield contacting the encapsulating resin and containing a magnetic material;
a control circuit board provided above the magnetic shield in the case; and
an electronic component fixed to the control circuit board.
7. The semiconductor module according to claim 6 , wherein the electronic component comprises a micro transformer for performing communications by giving and receiving magnetic fields.
8. The semiconductor module according to claim 1 , wherein
a thermal conductivity of the magnetic shield is higher than a thermal conductivity of the encapsulating resin, and
surface roughness of an upper surface of the magnetic shield is larger than surface roughness of an upper surface of the encapsulating resin.
9. The semiconductor module according to claim 1 , wherein the magnetic shield is resin containing a magnetic material.
10. The semiconductor module according to claim 9 , wherein the magnetic shield is epoxy resin containing ferrite powder.
11. The semiconductor module according to claim 1 , wherein the magnetic shield is any one of liquid, gel, rubber, and elastomer.
12. The semiconductor module according to claim 1 , wherein the semiconductor component is made of a wide-bandgap semiconductor.
13. The semiconductor module according to claim 12 , wherein the wide-bandgap semiconductor is any one of silicon carbide, gallium nitride materials, and diamond.
14. A power converter comprising:
a semiconductor module comprising:
a case;
a semiconductor component provided in the case for switching a current;
encapsulating resin provided in the case for covering the semiconductor component;
a magnetic shield contacting the encapsulating resin and containing a magnetic material; and
an embedded magnetic shield embedded in the case so as to be surrounded by the case on all sides, the embedded magnetic shield containing a magnetic material; and
a control circuit provided outside the semiconductor module for transmitting a control signal to the semiconductor component.