Method of using separate wafer contacts during wafer processing
Embodiments of the invention are directed towards improving on-wafer process performance and processing at increased processing fluid/wafer temperature while maintaining good process performance. A method for processing a wafer in a process chamber is described where the process chamber includes a wafer holder having first and second sets of edge grippers for independently securing the wafer at the wafer edge during processing, treating the wafer with a first processing fluid while securing the wafer with the first set of edge grippers, but not with the second set of edge grippers, treating the wafer with a second processing fluid while securing the wafer with the first set of edge grippers, but not with the second set of edge grippers, and treating the wafer with a third processing fluid while securing the wafer with the second set of edge grippers, but not with the first set of edge grippers.
1. A method for processing a wafer in a process chamber, the process chamber including a wafer holder having first and second sets of edge grippers for independently securing the wafer at the wafer edge during processing, the method comprising:
treating the wafer with a first processing conditions while securing the wafer with the first set of edge grippers, but not with the second set of edge grippers; and
treating the wafer with a second processing conditions while securing the wafer with the second set of edge grippers, but not with the first set of edge grippers;
wherein a material of the first set of edge grippers that contacts the edge of the wafer is different than a material of the second set of edge grippers that contacts the edge of the wafer.
2. The method of claim 1 , wherein the first processing conditions is a higher temperature process than that of the second processing conditions, and the material of the first set of edge grippers that contacts the edge of the wafer can tolerate a higher temperature than the material of the second set of edge grippers that contacts the edge of the wafer.
3. The method of claim 1 , wherein the material of the first set of edge grippers that contacts the edge of the wafer includes carbon fiber enforced perfluoro alkoxy copolymer (PFA) and the material of the second set of edge grippers that contacts the edge of the wafer consists of PFA.
4. The method of claim 1 , wherein the first processing conditions comprises treating the wafer with a first processing fluid that contains an acid solution while securing the wafer with the first set of edge grippers, but not with the second set of edge grippers; and
the second processing conditions comprises treating the wafer with a second processing fluid that contains a rinsing solution while securing the wafer with the second set of edge grippers, but not with the first set of edge grippers.
5. The method of claim 4 , wherein the material of the first set of edge grippers that contacts the edge of the wafer includes carbon fiber enforced PFA and the material of the second set of edge grippers that contacts the edge of the wafer consists of PFA.
6. The method of claim 1 , wherein the first set of edge grippers includes three edge grippers separated by about 120 degree angles.
7. The method of claim 1 , wherein the second set of edge grippers includes three edge grippers separated by about 120 degree angles.