Optical waveguide device and method for manufacturing the same
An optical waveguide device includes a wiring board, an optical waveguide, an optical path conversion mirror, a hole, and a lens component. The optical waveguide is disposed on the wiring board and includes first and second cladding layers and a core layer. The optical path conversion mirror is formed in the optical waveguide. The hole is formed in the first and second cladding layers and outside an optical waveguide formation region. The lens component is optically coupled to the optical path conversion mirror. The lens component includes a lens main body, a bump, and protrusion portions. The lens main body has a lens function. The bump is fixed to a structure including the wiring board and the optical waveguide, in the hole by a joining material. A diameter of a tip end of the bump of the lens component is smaller than a minimum diameter of the hole.
1. An optical waveguide device comprising:
a wiring board;
an optical waveguide disposed on the wiring board and including a first cladding layer, a core layer, and a second cladding layer;
an optical path conversion mirror formed in the optical waveguide;
a hole formed in the first cladding layer and the second cladding layer and outside an optical waveguide formation region where the optical waveguide is formed; and
a lens component that is optically coupled to the optical path conversion mirror, wherein
the lens component comprises
a lens main body having a lens function,
a bump that is fixed to a structure including the wiring board and the optical waveguide, in the hole by a joining material, and
protrusion portions that protrude from the lens main body, and
a diameter of a tip end of the bump of the lens component is smaller than a minimum diameter of the hole.
2. The device of claim 1 , wherein
the wiring board comprises a metal pad that is formed at a bottom of the hole,
the bump of the lens component is a metal bump,
the joining material is a metal joining material, and
the metal bump of the lens component is joined to the metal pad by the metal joining material.
3. The device of claim 2 , wherein the metal joining material is solder.
4. The device of claim 2 , wherein the wiring board comprises a wiring layer that is disposed at the same height as the metal pad and that is not electrically connected to the metal pad.
5. The device of claim 1 , wherein
the wiring board comprises an insulating layer a portion of which is exposed at a bottom of the hole,
the bump of the lens component is made of the same material as the lens main body,
the joining material is a resin adhesive, and
the bump of the lens component is bonded to the portion, exposed at the bottom of the hole, of the insulating layer by the resin adhesive.
6. The device of claim 1 , further comprising:
a fixing resin portion that is formed around an outer circumferential portion of the lens component and that fixes the lens component to the optical waveguide.
7. The device of claim 1 , further comprising:
a fixing resin portion that surrounds at least two of the protrusion portions of the lens component and that fixes the lens component to the optical waveguide.
8. The device of claim 1 , wherein the lens component is made of glass.
9. The device of claim 1 , wherein the lens component is made of resin.
10. The device of claim 1 , wherein the lens main body is made of glass.
11. The device of claim 1 , wherein the lens main body is made of resin.
12. The device of claim 1 , wherein
the second cladding layer is formed on the first cladding layer in a region outside the optical waveguide formation region, and
the protrusion portions abut against the second cladding layer.
13. The device of claim 1 , wherein
the bump of the lens component is a metal bump, and
the metal bump is fixed to the lens main body via a metal seat.
14. The device of claim 1 , wherein the lens main body comprises a convex lens that provides the lens function.