Indium-containing oxide film and preparing method thereof
The present invention relates to an indium oxide film formed by chemical vapor deposition or atomic layer deposition, or to an oxide film containing indium, and to a method for forming same. By chemical vapor deposition or atomic layer deposition, wherein an indium material that is a liquid at room temperature is used, an oxide film containing indium can be formed on a substrate having a large area, and particularly a substrate for manufacturing a display device.
1. A method for forming an indium-containing oxide film comprising:
providing an oxygen-containing gas and an indium compound in a gas state to a substrate to be reacted;
wherein the indium compound is a liquid at room temperature and includes bis(trimethylsilyl)aminodiethylindium.
2. The method for forming the indium-containing oxide film of claim 1 , wherein a resistivity of the indium-containing oxide film is 1×10 −4 Ω·cm or less.
3. The method for forming the indium-containing oxide film of claim 2 , wherein the resistivity of the indium-containing oxide film is 2×10 −5 Ω·cm.
4. The method for forming the indium-containing oxide film of claim 1 , wherein the substrate is maintained at a temperature of from room temperature to 500° C.
5. The method for forming the indium-containing oxide film of claim 1 , wherein the substrate is maintained at a temperature of from 175° C. to 300° C.
6. The method for forming the indium-containing oxide film of claim 1 , wherein the substrate is maintained at a temperature of from 225° C. to 300° C.
7. The method for forming the indium-containing oxide film of claim 1 , wherein the indium-containing oxide film is formed by chemical vapor deposition or atomic layer deposition.
8. The method for forming the indium-containing oxide film of claim 1 , wherein the oxygen-containing gas includes a gas selected from the group consisting of H 2 O, H 2 O 2 , O 2 , O 3 , and combinations thereof.
9. The method for forming the indium-containing oxide film of claim 1 , wherein the substrate includes a glass, silicon, silicon oxide, or a polymer.
10. The method for forming the indium-containing oxide film of claim 1 , wherein the indium-containing oxide film does not include an element other than indium, oxygen, and carbon.