Semiconductor device and manufacturing method of the same

1. A semiconductor device comprising:

a first insulating film;

a first barrier film over the first insulating film;

a second insulating film over the first barrier film, the second insulating film including a region containing oxygen at a higher proportion than oxygen in a stoichiometric composition; and

a first transistor comprising a first oxide semiconductor film over the second insulating film,

wherein an amount of hydrogen molecules released from the first insulating film at a temperature higher than or equal to 400° C., which is measured by thermal desorption spectroscopy, is less than or equal to 130% of an amount of released hydrogen molecules at 300° C.

2. The semiconductor device according to claim 1 ,

wherein in the first insulating film, a detection intensity of a mass-to-charge ratio of 2 with respect to a temperature is less than or equal to 4×10 −11 A at 400° C., which is measured by thermal desorption spectroscopy.

3. The semiconductor device according to claim 1 ,

wherein the first transistor further comprising:

a source electrode and a drain electrode which are in contact with the first oxide semiconductor film;

a gate insulating film over the first oxide semiconductor film, the source electrode, and the drain electrode; and

a gate electrode over the gate insulating film,

wherein a concentration of hydrogen in each of the gate insulating film, the second insulating film, and the first oxide semiconductor film is lower than 5×10 18 atoms/cm 3 .

4. The semiconductor device according to claim 3 ,

wherein the gate electrode faces a top surface and a side surface of the first oxide semiconductor film with the gate insulating film interposed therebetween.

5. The semiconductor device according to claim 3 ,

wherein a capacitor is provided to be electrically connected to the source electrode or the drain electrode of the first transistor, and

wherein an off-state current per microfarad of capacitance and per micrometer of channel width of the first transistor is lower than 4.3 yA at 85° C.

6. The semiconductor device according to claim 3 ,

wherein a capacitor is provided to be electrically connected to the source electrode or the drain electrode of the first transistor, and

wherein an off-state current per microfarad of capacitance and per micrometer of channel width of the first transistor is lower than 1.5 yA at 95° C.

7. The semiconductor device according to claim 1 ,

wherein the first barrier film comprises aluminum oxide, and

wherein an amount of hydrogen molecules released from the first barrier film at a temperature higher than or equal to 20° C. and lower than or equal to 600° C., which is measured by thermal desorption spectroscopy, is less than 2×10 15 /cm 2 .

8. The semiconductor device according to claim 1 , further comprising a second barrier film over the first transistor.

9. The semiconductor device according to claim 8 ,

wherein the second barrier film comprises aluminum oxide, and

wherein an amount of hydrogen molecules released from the second barrier film at a temperature higher than or equal to 20° C. and lower than or equal to 600° C., which is measured by thermal desorption spectroscopy, is less than 2×10 15 /cm 2 .

10. The semiconductor device according to claim 1 ,

wherein a second oxide semiconductor film and a third oxide semiconductor film are provided with the first oxide semiconductor film interposed therebetween, and

wherein the second oxide semiconductor film and the third oxide semiconductor film each comprise one or more kinds of metal elements contained in the first oxide semiconductor film.

11. The semiconductor device according to claim 1 ,

wherein a second transistor formed using a semiconductor substrate is provided under the first insulating film to be electrically connected to the first transistor.

12. The semiconductor device according to claim 1 ,

wherein the S value of the first transistor is greater than or equal to 60 mV/dec. and less than or equal to 100 mV/dec.

13. A semiconductor device comprising:

a first insulating film;

a first barrier film over the first insulating film;

a second insulating film over the first barrier film, the second insulating film including a region containing oxygen at a higher proportion than oxygen in a stoichiometric composition; and

a first transistor comprising a first oxide semiconductor film over the second insulating film,

wherein an amount of hydrogen molecules released from the first insulating film at 450° C., which is measured by thermal desorption spectroscopy, is less than or equal to 130% of an amount of released hydrogen molecules at 350° C.

14. A semiconductor device comprising:

a memory cell comprising:

a first transistor comprising an oxide semiconductor film comprising a channel formation region; and

a second transistor,

wherein one of a source and a drain of the first transistor is electrically connected to a node,

wherein a gate of the second transistor is electrically connected to the node, and

wherein the memory cell is configured to hold data in the node at 85° C. for 10 years or longer when the first transistor is in an off-state.

15. A semiconductor device according to claim 14 , further comprising:

a first insulating film;

a first barrier film over the first insulating film; and

a second insulating film over the first barrier film, the second insulating film including a region containing oxygen at a higher proportion than oxygen in a stoichiometric composition;

wherein the oxide semiconductor film is over the second insulating film, and

wherein an amount of hydrogen molecules released from the first insulating film at a temperature higher than or equal to 450° C., which is measured by thermal desorption spectroscopy, is less than or equal to 130% of an amount of released hydrogen molecules at 300° C.