Package structure for flexible organic light emitting diode device, method for packaging the same and flexible display device

1. A package structure for a flexible organic light emitting diode (OLED) device, comprising:

a flexible substrate, arranged to support the OLED device;

a packaging layer, provided on the flexible substrate;

the OLED device, provided on the packaging layer; and

a waterproof and oxygenproof transparent thin film, covering the OLED device;

wherein the packaging layer comprises a passivation layer and a to-be-cured resin layer;

wherein the flexible substrate comprises an ultra-thin glass having flexibility and a waterproof and oxygenproof resin layer covering the ultra-thin glass;

wherein a size of the waterproof and oxygenproof resin layer is slightly larger than that of the ultra-thin glass such that both a length and a width of the waterproof and oxygenproof resin layer respectively exceed a length and a width of the ultra-thin glass by 0.1 mm-2 mm;

wherein a thickness of the ultra-thin glass is 0.05 mm-0.2 mm and a flexible radius of the ultra-thin glass is 40 mm-80 mm; and

wherein a thickness of the waterproof and oxygenproof resin layer is 0.03 mm-3 mm, and a temperature resistance of the waterproof and oxygenproof resin layer at least satisfies that the waterproof and oxygenproof resin layer is capable of remaining undeformed under 100 degrees Celsius for at least two hours.

2. The package structure for the flexible OLED device according to claim 1 , further comprising:

a further flexible substrate, provided on the waterproof and oxygenproof transparent thin film.

3. A method for packaging the flexible organic light emitting diode (OLED) device according to claim 1 , comprising:

providing a first transparent rigid substrate attached with a waterproof and oxygenproof transparent thin film;

attaching the OLED device on the waterproof and oxygenproof transparent thin film;

forming a packaging layer on the OLED device;

providing a second transparent rigid substrate;

forming a flexible substrate on the second transparent rigid substrate;

forming a cell by using the first transparent rigid substrate on which the packaging layer is formed and the second transparent rigid substrate on which the flexible substrate is formed, and packaging the first transparent rigid substrate and the second transparent rigid substrate within the cell; and

removing the first transparent rigid substrate and the second transparent rigid substrate.

4. The method according to claim 3 , wherein the step of forming a flexible substrate on the second transparent rigid substrate comprises:

attaching ultra-thin glass having flexibility on the second transparent rigid substrate; and

forming a waterproof and oxygenproof resin layer covering the ultra-thin glass on the ultra-thin glass.

5. The method according to claim 3 , wherein the flexible substrate is further provided between the waterproof and oxygenproof transparent thin film and the first transparent rigid substrate.

6. The method according to claim 3 , wherein the step of forming a flexible substrate on the second transparent rigid substrate comprises:

attaching a metal thin film on the second transparent rigid substrate; and

forming a waterproof and oxygenproof resin layer covering the metal thin film on the metal thin film.

7. The method according to claim 3 , wherein

if an adhesive tape is used to attach the first transparent rigid substrate with the waterproof and oxygenproof transparent thin film and to attach the second transparent rigid substrate with the flexible substrate, then a mechanical method is applied in the step of removing the first transparent rigid substrate and the second transparent rigid substrate; or

if a removable layer is used to attach the first transparent rigid substrate with the waterproof and oxygenproof transparent thin film and to attach the second transparent rigid substrate with the flexible substrate, then an ultraviolet irradiation method is applied in the step of removing the first transparent rigid substrate and the second transparent rigid substrate.

8. A flexible display device, which comprises a package structure for a flexible organic light emitting diode (OLED) device, the flexible display device comprising:

a flexible substrate, arranged to support the OLED device;

a packaging layer, provided on the flexible substrate;

the OLED device, provided on the packaging layer; and

a waterproof and oxygenproof transparent thin film, covering the OLED;

wherein the packaging layer comprises a passivation layer and a to-be-cured resin layer;

wherein the flexible substrate comprises an ultra-thin glass having flexibility and a waterproof and oxygenproof resin layer covering the ultra-thin glass;

wherein a size of the waterproof and oxygenproof resin layer is slightly larger than that of the ultra-thin glass such that both a length and a width of the waterproof and oxygenproof resin layer respectively exceed a length and a width of the ultra-thin glass by 0.1 mm-2 mm;

wherein a thickness of the ultra-thin glass is 0.05 mm-0.2 mm and a flexible radius of the ultra-thin glass is 40 mm-80 mm; and

wherein a thickness of the waterproof and oxygenproof resin layer is 0.03 mm-3 mm, and a temperature resistance of the waterproof and oxygenproof resin layer at least satisfies that the waterproof and oxygenproof resin layer is capable of remaining undeformed under 100 degrees Celsius for at least two hours.

9. The flexible display device according to claim 8 , wherein

the flexible display device comprises at least one of electronic papers, televisions (TVs), display devices, digital photo frames, mobile phones and tablet computers.

10. The flexible display device according to claim 8 , further comprising:

a further flexible substrate, provided on the waterproof and oxygenproof transparent thin film.