Bonding wire and method for manufacturing same
It is an object of the present invention to provide a bonding wire capable of maintaining a structure and a configuration thereof at the time of performing wire bonding; and a manufacturing method thereof. Provided is a bonding wire having a core member mainly composed of copper; and a palladium coating layer. Particularly, formed in a center of the core member is a fibrous structure with copper crystals extending in an axial direction.
1. A bonding wire comprising:
a core member mainly composed of copper; and
a palladium coating layer, wherein
said core member includes a fibrous structure with copper crystals extending in an axial direction, said fibrous structure being formed in a center of said core member, and
said core member includes a grain-shaped recrystallized region formed through a recrystallization of crystals, said grain-shaped recrystallized region being formed surrounding said fibrous structure.
2. The bonding wire according to claim 1 , further including a gold coating layer formed on said palladium coating layer.
3. The bonding wire according to claim 1 , wherein said fibrous structure exists in said core member in an amount of 0.5 to 90% by mass.
4. The bonding wire according to claim 2 , wherein said fibrous structure exists in said core member in an amount of 0.5 to 90% by mass.
5. The bonding wire according to claim 1 , wherein said fibrous structure exists within a region of 0.8R from a center, provided that a radius of said core member is R.
6. The bonding wire according to claim 2 , wherein said fibrous structure exists within a region of 0.8R from a center, provided that a radius of said core member is R.
7. The bonding wire according to claim 3 , wherein said fibrous structure exists within a region of 0.8R from a center, provided that a radius of said core member is R.
8. The bonding wire according to claim 4 , wherein said fibrous structure exists within a region of 0.8R from a center, provided that a radius of said core member is R.