Semiconductor device including a semiconductor element and a fixed member to which the semiconductor element is fixed
A semiconductor device includes a semiconductor element having a rectangular shape in a plan view, and a fixed member to which the semiconductor element is fixed. The semiconductor element is disposed so that a rectangular face of the semiconductor element is faced toward a surface of the fixed member. A part of the rectangular face of the semiconductor element is fixed to the surface of the fixed member. At least corner parts of the rectangular face of the semiconductor element are not fixed to the surface of the fixed member.
1. A semiconductor device comprising:
a semiconductor element having a rectangular shape in a plan view; and
a fixed member to which the semiconductor element is fixed, wherein
the semiconductor element is disposed so that a rectangular face of the semiconductor element is faced toward a surface of the fixed member,
a part of the rectangular face of the semiconductor element is fixed to the surface of the fixed member with a joint material,
a dent having a pointed bottom is provided on the surface of the fixed member at a position corresponding to each of the corner parts of the rectangular face of the semiconductor element, and
at least corner parts of the rectangular face of the semiconductor element are not fixed to the surface of the fixed member.
2. The semiconductor device according to claim 1 , wherein
the pointed bottom of each of the dents is positioned inside the corresponding dent in a plan view of the fixed member.
3. The semiconductor device according to claim 2 , wherein
each of the dents has a semi-conical shape, a conical shape, an elliptic conical shape, or a polygonal pyramid shape.
4. The semiconductor device according to claim 2 , wherein
each of the dents has a three-sided pyramid shape.
5. The semiconductor device according to claim 4 , wherein
each of the dents includes a center-sided face positioned on a center side of the semiconductor element, and
an angle formed by the center-sided face of each of the dents and a surface of the fixed member is less than 45 degrees.
6. The semiconductor device according to claim 1 , wherein
each of the dents has a semi-conical shape, a conical shape, an elliptic conical shape, or a polygonal pyramid shape.
7. The semiconductor device according to claim 1 , wherein
each of the dents has a three-sided pyramid shape.
8. The semiconductor device according to claim 7 , wherein
each of the dents includes a center-sided face positioned on a center side of the semiconductor element, and
an angle formed by the center-sided face of each of the dents and a surface of the fixed member is less than 45 degrees.