Interconnects having sealing structures to enable selective metal capping layers
Methods of fabricating a capped interconnect for a microelectronic device which includes a sealing feature for any gaps between a capping layer and an interconnect and structures formed therefrom. The sealing features improve encapsulation of the interconnect, which substantially reduces or prevents electromigration and/or diffusion of conductive material from the capped interconnect.
1. A method of fabricating an interconnect structure, comprising:
providing an interconnect including a conductive material extending into a dielectric material layer;
forming capping layer proximate said interconnect;
forming a sealing structure to seal at least one gap of exposed interconnect conductive material between said capping layer and said dielectric layer; and
exposing the exposed interconnect conductive material to silane to form a first salicide layer; and
exposing the first salicide layer to an ammonia source to form a silicon nitride layer.
2. The method of claim 1 , wherein forming the sealing structure comprises:
exposing an exposed surface of the capping layer to silane to form a second salicide layer; and
exposing the second salicide layer to the ammonia source to form the silicon nitride layer.
3. The method of claim 2 , wherein said sealing structure comprises the silicon nitride layer that is different than the capping material layer.
4. The method of claim 2 , wherein the first silicide layer is formed at a different rate than the second silicide layer.
5. A method of fabricating an interconnect structure, comprising:
providing a dielectric material layer;
forming an opening within said dielectric material layer;
forming a barrier material layer on at least one sidewall and bottom of said opening;
disposing a conductive material within said opening and abutting said barrier material layer;
forming capping layer proximate said conductive material;
forming a sealing structure to seal at least one gap of exposed conductive material between said capping layer and said dielectric layer, wherein forming said sealing structure comprises forming a salicide in portions of a conductive material of said interconnect by exposure to silane and exposing said salicide to an ammonia source to form a silicon nitride layer.
6. The method of claim 5 , wherein the sealing structure comprises the silicon nitride layer that is different than the capping material layer.