IP Library › Granted Patent US 9,443,874
Granted Patent B2
US 9,443,874 · App. 14/320,742 · Granted Sep 13, 2016

Semiconductor device and method for manufacturing the same

Inventors: Akiharu Miyanaga (Kanagawa, JP); Junichiro Sakata (Kanagawa, JP); Masayuki Sakakura (Tochigi, JP); Masahiro Takahashi (Kanagawa, JP); Hideyuki Kishida (Kanagawa, JP); Shunpei Yamazaki (Tokyo, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
H01L27/1225H01L27/1214H01L27/1222H01L29/45H01L29/7869H01L29/78618H01L27/3262
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Quick Facts
Patent No.
US 9,443,874
App. No.
14/320,742
Granted
Sep 13, 2016
Kind
B2
Abstract

An object is to provide a thin film transistor having favorable electric characteristics and a semiconductor device including the thin film transistor as a switching element. The thin film transistor includes a gate electrode formed over an insulating surface, a gate insulating film over the gate electrode, an oxide semiconductor film which overlaps with the gate electrode over the gate insulating film and which includes a layer where the concentration of one or a plurality of metals contained in the oxide semiconductor is higher than that in other regions, a pair of metal oxide films formed over the oxide semiconductor film and in contact with the layer, and a source electrode and a drain electrode in contact with the metal oxide films. The metal oxide films are formed by oxidation of a metal contained in the source electrode and the drain electrode.

Claims (56)

1. An e-book reader comprising:

a housing; and

a display portion comprising:

a flexible substrate;

a gate electrode and an oxide semiconductor film over the flexible substrate, the gate electrode and the oxide semiconductor film overlapping each other with a gate insulating film therebetween;

a metal oxide film in contact with a first region of the oxide semiconductor film, the metal oxide film and a second region of the oxide semiconductor film overlapping each other with the first region of the oxide semiconductor film therebetween; and

a conductive film in contact with the metal oxide film, the conductive film comprising a metal element,

wherein a resistance of the first region of the oxide semiconductor film is lower than a resistance of the second region of the oxide semiconductor film,

wherein each of the first region of the oxide semiconductor film and the second region of the oxide semiconductor film comprises In, Ga, Zn, and O, and

wherein a concentration of In in the first region of the oxide semiconductor film is higher than a concentration of In in the second region of the oxide semiconductor film.

2. The e-book reader according to claim 1 , wherein the metal element is titanium, tungsten, or molybdenum.

3. The e-book reader according to claim 1 , wherein a thickness of the first region of the oxide semiconductor film is more than or equal to 2 nm and less than or equal to 10 nm.

4. The e-book reader according to claim 1 , wherein a thickness of the metal oxide film is more than or equal to 2 nm and less than or equal to 10 nm.

5. The e-book reader according to claim 1 , further comprising an insulating film over the conductive film, wherein the insulating film is in contact with the oxide semiconductor film.

6. An e-book reader comprising:

a housing; and

a display portion comprising:

a flexible substrate;

a gate electrode over the flexible substrate;

a gate insulating film over the gate electrode;

an oxide semiconductor film over the gate electrode with the gate insulating film therebetween, the oxide semiconductor film comprising a first region and a second region over the first region;

a metal oxide film over and in contact with the second region of the oxide semiconductor film; and

a conductive film over and in contact with the metal oxide film, the conductive film comprising a metal element,

wherein a resistance of the second region of the oxide semiconductor film is lower than a resistance of the second region of the oxide semiconductor film,

wherein each of the first region of the oxide semiconductor film and the second region of the oxide semiconductor film comprises In, Ga, Zn, and O, and

wherein a concentration of In in the second region of the oxide semiconductor film is higher than a concentration of In in the first region of the oxide semiconductor film.

7. The e-book reader according to claim 6 , wherein the metal element is titanium, tungsten, or molybdenum.

8. The e-book reader according to claim 6 , wherein a thickness of the first region of the oxide semiconductor film is more than or equal to 2 nm and less than or equal to 10 nm.

9. The e-book reader according to claim 6 , wherein a thickness of the metal oxide film is more than or equal to 2 nm and less than or equal to 10 nm.

10. The e-book reader according to claim 6 , further comprising an insulating film over the conductive film, wherein the insulating film is in contact with the oxide semiconductor film.

11. A semiconductor device comprising:

a substrate;

a gate electrode and an oxide semiconductor film over the substrate, the gate electrode and the oxide semiconductor film overlapping each other with a gate insulating film therebetween;

a metal oxide film in contact with a first region of the oxide semiconductor film, the metal oxide film and a second region of the oxide semiconductor film overlapping each other with the first region of the oxide semiconductor film therebetween; and

a conductive film in contact with the metal oxide film, the conductive film comprising a metal element,

wherein a resistance of the first region of the oxide semiconductor film is lower than a resistance of the second region of the oxide semiconductor film,

wherein each of the first region of the oxide semiconductor film and the second region of the oxide semiconductor film comprises In, Ga, Zn, and O, and

wherein a concentration of In in the first region of the oxide semiconductor film is higher than a concentration of In in the second region of the oxide semiconductor film.

12. The semiconductor device according to claim 11 , wherein the metal element is titanium, tungsten, or molybdenum.

13. The semiconductor device according to claim 11 , wherein a thickness of the first region of the oxide semiconductor film is more than or equal to 2 nm and less than or equal to 10 nm.

14. The semiconductor device according to claim 11 , wherein a thickness of the metal oxide film is more than or equal to 2 nm and less than or equal to 10 nm.

15. The semiconductor device according to claim 11 , further comprising an insulating film over the conductive film, wherein the insulating film is in contact with the oxide semiconductor film.

16. A semiconductor device comprising:

a substrate;

a gate electrode over the substrate;

a gate insulating film over the gate electrode;

an oxide semiconductor film over the gate electrode with the gate insulating film therebetween, the oxide semiconductor film comprising a first region and a second region over the first region;

a metal oxide film over and in contact with the second region of the oxide semiconductor film; and

a conductive film over and in contact with the metal oxide film, the conductive film comprising a metal element,

wherein a resistance of the second region of the oxide semiconductor film is lower than a resistance of the second region of the oxide semiconductor film,

wherein each of the first region of the oxide semiconductor film and the second region of the oxide semiconductor film comprises In, Ga, Zn, and O, and

wherein a concentration of In in the second region of the oxide semiconductor film is higher than a concentration of In in the first region of the oxide semiconductor film.

17. The semiconductor device according to claim 16 , wherein the metal element is titanium, tungsten, or molybdenum.

18. The semiconductor device according to claim 16 , wherein a thickness of the first region of the oxide semiconductor film is more than or equal to 2 nm and less than or equal to 10 nm.

19. The semiconductor device according to claim 16 , wherein a thickness of the metal oxide film is more than or equal to 2 nm and less than or equal to 10 nm.

20. The semiconductor device according to claim 16 , further comprising an insulating film over the conductive film, wherein the insulating film is in contact with the oxide semiconductor film.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 31, 2014
From: MIYANAGA, AKIHARU; SAKATA, JUNICHIRO; SAKAKURA, MASAYUKI; TAKAHASHI, MASAHIRO; KISHIDA, HIDEYUKI; YAMAZAKI, SHUNPEI
To: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Reel/Frame 033430/0258 →
Priority Claims (1)
JP 2009-235570 · Oct 9, 2009 · national
Continuity (2)
Continuation 12900136 · Oct 7, 2010
Related Publication 20140312345A1 · Oct 23, 2014