Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same

1. An apparatus including a direct fluid-contact thermal block to temperature-control a semiconductive device, comprising:

a first laminate type including a plurality of unit block perimeters;

a base plane second laminate type, wherein the base plane second laminate type includes at least one heat-transfer fluid unit cell, the at least one heat-transfer fluid unit cell including:

a fluid supply structure including a supply-orifice cross-sectional area; and

a fluid return structure including a return-orifice cross-sectional area, wherein the supply-orifice cross-sectional area is greater than the return-orifice cross-sectional area;

a third laminate type including fluid-supply distributors coupled to the fluid supply structure, and fluid-return collectors coupled to the fluid return structure;

a fourth laminate type including fluid supply- and return routers, respectively, that couple to the respective fluid supply- and return distributors and collectors;

a fifth laminate type includes fluid supply- and return plenums, respectively, that couple to the respective fluid supply- and return routers; and

a sixth laminate type including a top plane of the direct fluid-contact thermal block and including supply-fluid inlets and return-fluid outlets, respectively, that are coupled to the respective fluid supply- and return plenums; wherein

the first laminate type is 5 mils (thousandths of an inch) thick and is a single layer;

the base plane second laminate type includes a fluid-flow array of 120 unit cells defined by a 24 unit-cell dimension along an X-axis and a five unit-cell dimension along a Y-axis, and wherein the base plane second laminate type is 5 mils thick and includes a total of 4 layers;

the third laminate type is 10 mils thick and includes a total of nine layers;

the fourth laminate type is 10 mils thick and includes a total of nine layers;

the fifth laminate type is 10 mils thick and includes a total of five layers; and

the sixth laminate type is 10 mils thick and includes a total of two layers.

2. The apparatus of claim 1 , wherein the laminate types comprise stainless steel.

3. The apparatus of claim 1 , wherein the laminate types comprise ceramic material.

4. The apparatus of claim 1 , wherein the laminate types comprise polymeric material.

5. The apparatus of claim 1 , wherein at least one of the laminate types includes resistive heating traces coupled thereto.

6. The apparatus of claim 1 , further comprising a chiller.

7. An apparatus including a direct fluid-contact thermal block to temperature-control a semiconductive device, comprising:

a first laminate type including a plurality of unit block perimeters;

a second laminate type includes a fluid supply structure comprising a plurality of fluid supply-orifices and a fluid return structure comprising a plurality of fluid return-orifices, the fluid supply structure and the fluid return structure configured to include a greater number of fluid supply-orifices than fluid return-orifices;

a third laminate type including fluid-supply distributors coupled to the fluid supply structure, and fluid-return collectors coupled to the fluid return structure;

a fourth laminate type including fluid supply- and return routers, respectively, that couple to the respective fluid supply- and return distributors and collectors;

a fifth laminate type includes fluid supply- and return plenums, respectively, that couple to the respective fluid supply- and return routers; and

a sixth laminate type including an upper layer of the direct fluid-contact thermal contact block and including supply-fluid inlets and return-fluid outlets, respectively, that are coupled to the respective fluid supply- and return plenums;

wherein the first laminate type is 5 mils thick and is a single layer;

wherein the second laminate type is 5 mils thick and includes a total of four layers;

wherein the third laminate type is 10 mils thick and includes a total of nine layers;

wherein the fourth laminate type is 10 mils thick and includes a total of nine layers;

wherein the fifth laminate type is 10 mils thick and includes a total of five layers; and

wherein the sixth laminate type is 10 mils thick and includes a total of two layers.

8. The apparatus of claim 7 , wherein the fluid supply structure includes twice as many fluid supply-orifices as fluid return-orifices.

9. The apparatus of claim 7 , wherein the second laminate type includes a planar surface including a plurality of heat-transfer fluid unit cells, the fluid supply-orifices and the fluid return-orifices positioned in the plurality of heat-transfer fluid unit cells, the plurality of heat-transfer fluid unit cells each including two supply orifices and a single return orifice therein.

10. The apparatus of claim 9 , wherein the second laminate type includes a fluid-flow array of 120 unit cells defined by a 24 unit-cell dimension along an X-axis and a five unit-cell dimension along a Y-axis.

11. The apparatus of claim 7 , wherein the laminate types comprise stainless steel.

12. The apparatus of claim 7 , wherein the laminate types comprise ceramic material.

13. The apparatus of claim 7 , wherein the laminate types comprise polymeric material.

14. The apparatus of claim 7 , wherein at least one of the laminate types includes resistive heating traces coupled thereto.

15. An apparatus including a plurality of layers laminated together to form a direct fluid-contact thermal block configured to temperature-control a semiconductive device, comprising:

a first laminate type including a first surface;

a second laminate type including fluid-supply orifices and fluid-return orifices arranged in a fluid-flow array of unit cells, the unit cells each including two fluid-supply orifices and a single fluid-return orifice positioned between the two fluid-supply orifices;

a third laminate type including fluid-supply distributors in communication with the fluid-supply orifices, and fluid-return distributors in communication with the fluid-return orifices;

a fourth laminate type including fluid-supply routers in communication with the fluid-supply distributors, and fluid-return routers in communication with the fluid-return distributors;

a fifth laminate type including fluid-supply plenums in communication with the fluid-supply routers, and fluid-return plenums in communication with the fluid-return routers; and

a sixth laminate type including supply-fluid inlets in communication with the fluid-supply plenums, and return-fluid outlets in communication with the fluid-return plenums;

wherein the first laminate type is 5 mils thick and is a single layer;

wherein the second laminate type is 5 mils thick and includes a total of four layers;

wherein the third laminate type is 10 mils thick and includes a total of nine layers;

wherein the fourth laminate type is 10 mils thick and includes a total of nine layers;

wherein the fifth laminate type is 10 mils thick and includes a total of five layers; and

wherein the sixth laminate type is 10 mils thick and includes a total of two layers.

16. The apparatus of claim 15 , wherein the laminate types comprise stainless steel.

17. The apparatus of claim 15 , wherein the laminate types comprise ceramic material.

18. The apparatus of claim 15 , wherein the laminate types comprise polymeric material.