Optical module integrated package
A an optical module integrated package includes a substrate, a light-receiving chip mounted in a light-receiving region of the substrate, an electronic component mounted in the substrate, a cover mounted on the substrate and having a light-receiving chip disposed above the light-receiving hole, and a lens fixedly mounted in the light-receiving hole of the cover. Thus, the optical module integrated package not only have the chip and the electronic component integrated therein to reduce the packaging cost and to improve the yield but also provide a light filtering, focusing or diffusing effect to enhance optical recognition accuracy.
1. An optical module integrated package, comprising:
a substrate defining a light-receiving region and a light-emitting region;
a light-receiving chip mounted in the light-receiving region of the substrate;
a light-emitting chip mounted in the light-emitting region of the substrate;
a cover mounted on the substrate, the cover comprising a light-emitting hole, a light-receiving hole, a first accommodation chamber, a second accommodation chamber and a partition wall separating the first accommodation chamber and the second accommodation chamber, the light-emitting hole and the light-receiving hole being respectively disposed above the light-emitting chip and the light-receiving chip, the first accommodation chamber and the second accommodation chamber being respectively disposed in communication with the light-emitting hole and the light-receiving hole; and
two lenses respectively mounted in the first accommodation chamber and the second accommodation chamber of the cover and respectively positioned below the light-emitting hole and the light-receiving hole.
2. The optical module integrated package as claimed in claim 1 , wherein the lenses are selected from the group of planar lenses, concave lenses and convex lenses.
3. The optical module integrated package as claimed in claim 1 , wherein the lenses are fixedly mounted in the cover.
4. The optical module integrated package as claimed in claim 1 , wherein one the lens is fixedly mounted in the cover and the other the lens is injection-molded on a light-emitting surface of the light-emitting chip.
5. The optical module integrated package as claimed in claim 1 , further comprising an electronic component mounted in the substrate.
6. The optical module integrated package as claimed in claim 5 , wherein the light-emitting chip, the light-receiving chip and the electronic component are bonded to the substrate using surface mounting technology.
7. The optical module integrated package as claimed in claim 5 , wherein the light-emitting chip, the light-receiving chip and the electronic component are bonded to the substrate using wire bond technology.
8. The optical module integrated package as claimed in claim 1 , wherein at least one the lens is mounted in the cover by adhesive bonding or injection molding.
9. The optical module integrated package as claimed in claim 1 , wherein the lens is selectively made of glass or plastics.
10. The optical module integrated package as claimed in claim 1 , wherein the lens comprises a filter layer coated on a surface thereof.