Control and driver circuits on a power quad flat no-lead (PQFN) leadframe
According to an exemplary implementation, a power quad flat no-lead (PQFN) leadframe includes U-phase and W-phase power switches situated on the PQFN leadframe and respectively connected to a U-phase output strip and a W-phase output pad of the PQFN leadframe. The PQFN leadframe further includes a common integrated circuit (IC) including a driver circuit and a control circuit where the common IC is connected to the U-phase output strip and to the W-phase output pad of the PQFN leadframe. The PQFN leadframe can also include a V-phase power switch situated on the PQFN leadframe where the V-phase power switch is connected to a V-phase output strip of the PQFN leadframe.
1. A power quad flat no-lead (PQFN) package comprising:
U-phase and W-phase power switches situated on a leadframe and respectively connected to a U-phase output strip and a W-phase output pad of said leadframe;
a common integrated circuit (IC) comprising a driver circuit and a control circuit, said common IC being connected to said U-phase output strip and to said W-phase output pad of said leadframe;
wherein said U-phase output strip extends from a U-phase output pad at a first edge of said PQFN package to a second edge on an opposite side of said PQFN package.
2. The PQFN package of claim 1 , further comprising a V-phase power switch situated on said leadframe, said V-phase power switch connected to a V-phase output strip of said leadframe.
3. The PQFN package of claim 1 , further comprising at least one wirebond connecting said common IC to said U-phase output strip.
4. The PQFN package of claim 1 wherein said W-phase power switch is situated on said W-phase output pad.
5. The PQFN package of claim 1 , wherein said W-phase output pad is connected to a W-phase output strip of said leadframe.
6. The PQFN package of claim 1 , further comprising a common supply voltage terminal for said driver circuit and said control circuit.
7. The PQFN package of claim 5 , further comprising a leadframe island situated on said W-phase output strip.
8. The PQFN package of claim 7 wherein said leadframe island is exposed on a bottom-side of said PQFN package.
9. The PQFN package of claim 1 , further comprising at least one wirebond connected between said common IC and a source of said U-phase power switch.
10. The PQFN package of claim 1 , wherein said U-phase and W-phase power switches comprise group III-V transistors.
11. The PQFN package of claim 1 , wherein said PQFN package has a footprint of greater than 12 mm by 12 mm.
12. The PQFN package of claim 1 , wherein said PQFN package has a footprint of less than 12 mm by 12 mm.
13. A power quad flat no-lead (PQFN) package comprising:
a multi-phase power inverter situated on a leadframe, said multi-phase power inverter including a U-phase output connected to a U-phase output strip of said leadframe and a W-phase output connected to a W-phase output pad of said leadframe;
a common integrated circuit (IC) comprising a driver circuit and a control circuit, said common IC being connected to said U-phase output strip and to said W-phase output pad of said leadframe;
wherein said U-phase output strip extends from a U-phase output pad at a first edge of said PQFN package to a second edge on an opposite side of said PQFN package.
14. The PQFN package of claim 13 , wherein said multi-phase power inverter further includes a V-phase output connected to a V-phase output strip of said leadframe.
15. The PQFN package of claim 13 , further comprising at least one wirebond connecting said common IC to said U-phase output strip.
16. The PQFN package of claim 13 , wherein said W-phase output pad is connected to a W-phase output strip of said leadframe.
17. The PQFN package of claim 13 , further comprising a common supply voltage terminal for said driver circuit and said control circuit.
18. The PQFN package of claim 13 , further comprising at least one wirebond connected between said common IC and a source of said multi-phase power inverter.
19. A power quad flat no-lead (PQFN) package comprising:
U-phase and V-phase power switches situated on a leadframe and respectively connected to a U-phase output strip and a V-phase output strip of said leadframe;
a common integrated circuit (IC) comprising a driver circuit and a control circuit, said common IC being connected to said U-phase output strip and to said V-phase output strip of said leadframe;
wherein said U-phase output strip extends from a U-phase output pad at a first edge of said PQFN package to a second edge on an opposite side of said PQFN package.
20. The PQFN package of claim 19 , further comprising at least one wirebond connecting said common IC to said U-phase output strip.
21. The PQFN package of claim 19 , further comprising at least one wirebond connecting said common IC to said V-phase output strip.
22. The PQFN package of claim 19 , further comprising a W-phase power switch situated on a W-phase output pad of said leadframe.
23. The PQFN package of claim 19 , further comprising a W-phase power switch situated on said leadframe, said W-phase power switch connected to a W-phase output strip of said leadframe.