Intrinsically safe battery pack

1. A battery pack, comprising:

a plurality of battery cells;

a printed circuit board (PCB) having top and bottom surfaces;

electrical components disposed on the top surface of the PCB;

a plurality of charger interface contacts and radio interface contacts disposed on the bottom surface of the PCB;

a low pressure mold (LPM) encapsulation formed only over the top side of the PCB, the LPM encapsulation covering the electrical components at a predetermined height that covers the tallest electrical component;

the top surface of the PCB having the electrical components and LPM encapsulation being oriented to face the plurality of battery cells within the battery pack;

spacers coupled to the cell stack; and

wherein the PCB surface covered with the LPM encapsulation is seated upon the spacers.

2. The battery pack of claim 1 , further comprising:

an insulator disposed between the LPM and the plurality of battery cells.

3. The battery pack of claim 1 , wherein the PCB comprises components disposed upon a single surface, the single surface being the top surface.

4. The battery pack of claim 1 , further comprising components disposed upon both bottom and top surfaces of the PCB.

5. The battery pack of claim 1 , wherein the LPM encapsulation is injection molded over the top surface of the PCB.

6. The battery pack of claim 1 , wherein the LPM encapsulation is formed of a polyamide material.

7. The battery pack of claim 1 , wherein PCB and the LPM encapsulation have apertures formed there through to provide a pass through for mating the electrical components to the plurality of battery cells.

8. The battery pack of claim 1 , wherein the battery pack is formed without a flex, a flex connector, a flex insulator, and a PCB insulator.

9. The battery pack of claim 1 , wherein the battery pack provides ATEX compliance with public safety communication products.

10. A battery pack, comprising:

a battery cell;

a printed circuit board (PCB) having top and bottom surfaces;

electrical components disposed on the top surface of the PCB;

interface contacts disposed on the bottom surface of the PCB, the interface contacts electrically coupling to the electrical components and the battery cell;

a low pressure mold (LPM) encapsulation formed only over the top side of the PCB, the LPM encapsulation covering the electrical components at a predetermined height that covers the tallest electrical component;

the top surface of the PCB having the electrical components disposed thereon and LPM encapsulation being oriented to the battery cell;

spacers coupled to the cell stack; and

wherein the PCB surface coated with the LPM encapsulation is seated upon the spacers.

11. The battery pack of claim 10 , further comprising:

an insulator coupled between the LPM encapsulation and the battery cell.

12. The battery pack of claim 11 , wherein the insulator is adhesively coupled between the LPM encapsulation and the battery cell.

13. The battery pack of claim 10 , wherein the interface contacts comprise:

radio and charger interface contacts disposed on the bottom surface of the PCB.

14. The battery pack of claim 10 , wherein the battery pack operates with ATEX compliant communication products.

15. The battery pack of claim 10 , wherein the LPM encapsulation is either a polyamide material or a polyolefin material.

16. A method for forming a battery pack, the method comprising:

disposing a plurality of electrical components on a top side of a printed circuit board (PCB), thereby forming a component side;

coating only the component side of the PCB with a low pressure molded (LPM) encapsulation, the LPM encapsulation covering the electrical components at a predetermined height that covers the tallest electrical component on the PCB;

providing a cell stack having at least one battery cell; and

orienting and coupling the top surface of the PCB having the plurality of electrical components and the LPM encapsulation to face cell stack;

coupling spacers to the cell stack; and

seating the PCB surface coated with the LPM encapsulation upon the spacers.

17. The method of claim 16 , further comprising disposing charger interface contacts and radio interface contacts on a bottom side of the PCB.

18. The method of claim 16 , further comprising coupling the LPM encapsulation to the cell stack using an adhesive spacer.

19. The method of claim 16 , wherein LPM is coated to the PCB using injection molding.

20. The method of claim 16 , wherein the battery pack is formed without a flex, a flex connector, a flex insulator, and a PCB insulator.