Light emitting device package including a substrate having at least two recessed surfaces
A light emitting device package includes a substrate having a first cavity and a second cavity directly under the first cavity, a light emitting part on the second cavity, a first metal layer on an inner side surface of the substrate, a second metal layer on the inner side surface of the substrate, a third metal layer on a bottom surface of the substrate, the third metal layer electrically connected to the first metal layer by a first via hole, a fourth metal layer on the bottom surface of the substrate, the fourth metal layer electrically connected to the second metal layer by a second via hole, and a fifth metal layer on the bottom surface of the substrate, the fifth metal layer disposed between the first via hole and the second via hole.
1. A light emitting device package comprising:
a substrate including a first cavity and a second cavity directly under the first cavity;
a light emitting part on the second cavity;
a first metal layer on an inner side surface of the substrate, the first metal layer electrically connected to the light emitting part;
a second metal layer on the inner side surface of the substrate, the second metal layer electrically connected to the light emitting part;
a third metal layer on a bottom surface of the substrate, the third metal layer electrically connected to the first metal layer by a first via hole;
a fourth metal layer on the bottom surface of the substrate, the fourth metal layer electrically connected to the second metal layer by a second via hole; and
a fifth metal layer on the bottom surface of the substrate, the fifth metal layer disposed between the first via hole and the second via hole,
wherein a width of the first via hole or the second via hole is smaller than a width of the light emitting part.
2. The light emitting device package of claim 1 , wherein the light emitting part is disposed between the first via hole and the second via hole.
3. The light emitting device package of claim 1 , wherein the light emitting part is not vertically overlapped with the second metal layer.
4. The light emitting device package of claim 1 , wherein the light emitting part is not vertically overlapped with the second via hole.
5. The light emitting device package of claim 1 , wherein the fifth metal layer is disposed between the first metal layer and the second metal layer.
6. The light emitting device package of claim 1 , wherein the fifth metal layer is disposed between the third metal layer and the fourth metal layer.
7. The light emitting device package of claim 1 , wherein the first via hole and the second via hole are disposed lower than the light emitting part.
8. The light emitting device package of claim 1 , wherein a bottom surface of the third metal layer is lower than a bottom surface of the light emitting part.
9. The light emitting device package of claim 1 , wherein the light emitting part is not vertically overlapped with the fifth metal layer.
10. The light emitting device package of claim 1 , wherein a top surface of the light emitting part is lower than a bottom surface of the first cavity.
11. A light emitting device package comprising:
a substrate including a first cavity and a second cavity directly under the first cavity;
a light emitting part on the second cavity;
a first metal layer and a second metal layer on an inner side surface of the substrate;
a third metal layer on a bottom surface of the substrate, the third metal layer electrically connected to the first metal layer by a first via hole;
a fourth metal layer on the bottom surface of the substrate, the fourth metal layer electrically connected to the second metal layer by a second via hole; and
a fifth metal layer on the bottom surface of the substrate,
wherein the light emitting part is disposed between the first via hole and the second via hole.
12. The light emitting device package of claim 11 , wherein the fifth metal layer is disposed between the first via hole and the second via hole and the fifth metal layer is not electrically connected to the second metal layer.
13. The light emitting device package of claim 11 , wherein the fifth metal layer is disposed between the first via hole and the second via hole, and wherein the fifth metal layer is not electrically connected to the first metal layer.
14. The light emitting device package of claim 11 , wherein the light emitting part is disposed between the third metal layer and the fourth metal layer.
15. The light emitting device package of claim 11 , wherein the light emitting part is not vertically overlapped with the first via hole.
16. The light emitting device package of claim 11 , wherein the light emitting part is not vertically overlapped with the first metal layer.
17. The light emitting device package of claim 11 , wherein a width of the first cavity is wider than a width of the second cavity.
18. The light emitting device package of claim 11 , wherein the first via hole and the second via hole pass through a part of the substrate.
19. The light emitting device package of claim 11 , wherein a bottom surface of the fourth metal layer is lower than a bottom surface of the light emitting part.
20. The light emitting device package of claim 11 , wherein the first via hole and the second via hole are disposed at outer area of the light emitting part.