Barrier laminate and novel polymer compound
The present invention provides a barrier laminate with enhanced heat resistance performance, comprising at least one organic layer and at least one inorganic barrier layer, the organic layer being formed by curing a polymerizable composition comprising a polymerizable compound having two or more polymerizable groups, and the total quantity of uncured component in the organic layer being 1.5 weight % or less of the total weight of the organic layer, and a novel polymerizable compound that can preferably used as the polymerizable compound, which is denoted by general formula (11): in general formula (11), R 21 denotes hydrogen atom or methyl group; R 22 denotes methyl group or cyclohexyl group; n denotes an integer of 0 to 2; and each instance of X denotes a group comprising a polymerizable group.
1. A barrier laminate comprising at least one organic layer and at least one inorganic barrier layer, the organic layer being formed by curing a polymerizable composition comprising a polymerizable compound,
wherein the polymerizable compound is a compound selected from the group consisting of the compounds denoted by general formula (1) and the compounds denoted by general formula (2):
in general formula (1), each of R 1 and R 2 denotes hydrogen atom, methyl group, or cyclohexyl group; R 3 denotes hydrogen atom or methyl group; R 4 denotes hydrogen atom or methyl group; R 5 denotes hydrogen atom or a group selected from group A below; R 6 denotes a monovalent substituent comprising a polymerizable group; and the compound denoted by general formula (1) comprises at least two polymerizable groups:
wherein each of R 1 and R 2 denotes hydrogen atom, methyl group, or cyclohexyl group;
R 6 denotes a monovalent substituent comprising a polymerizable group; and * denotes a binding position;
in general formula (2), R 6 denotes a monovalent substituent comprising a polymerizable group; each of R 7 , R 8 , and R 9 denotes hydrogen atom, methyl group, or cyclohexyl group; and m denotes 0 or 1,
wherein at least 60 weight % of the total solid fraction of the polymerizable composition is the polymerizable compound selected from the group consisting of the compounds denoted by general formula (1) and the compounds denoted by general formula (2).
2. The barrier laminate according to claim 1 , wherein at least 75 weight % of the total solid fraction of the polymerizable composition is the polymerizable compound selected from the group consisting of the compounds denoted by general formula (1) and the compounds denoted by general formula (2).
3. The barrier laminate according to claim 1 , wherein the polymerizable compound is a polymerizable compound denoted by general formula (11):
in general formula (11), R 21 denotes hydrogen atom or methyl group; R 22 denotes methyl group or cyclohexyl group; n denotes an integer of from 0 to 2; and each instance of X independently denotes a group denoted by any one of formulas (a) to (d) below:
in formulas (a), (b), and (d), R 23 denotes hydrogen atom or methyl group and * denotes a binding position.
4. The barrier laminate according to claim 3 , wherein R 21 denotes methyl group.
5. The barrier laminate of according to claim 3 , wherein n denotes 0.
6. The barrier laminate according to claim 1 , which comprises the inorganic barrier layer on the surface of the organic layer.
7. The barrier substrate according to claim 1 , which has a structure formed by laminating the inorganic barrier layer, organic layer, and inorganic barrier layer in that order in mutually adjacent fashion.
8. A gas barrier film wherein the barrier laminate according to claim 1 is provided on a substrate film.
9. A device comprising the barrier laminate according to claim 1 .
10. A solar cell element or an organic EL element comprising the barrier laminate according to claim 1 .
11. A device optical element comprising the barrier laminate according to claim 1 .
12. A bag for sealing a device, comprising the barrier laminate according to claim 1 .
13. A method of manufacturing the barrier laminate according to claim 1 , comprising removing impurities from a composition (A) comprising a polymerizable compound, and then curing a polymerizable composition comprising the composition (A) comprising a polymerizable compound to form an organic layer.
14. A method of manufacturing a device, comprising providing a barrier laminate by the method of manufacturing a barrier laminate according to claim 13 .
15. A polymerizable compound denoted by general formula (11):
in general formula (11), R 21 denotes hydrogen atom or methyl group; R 22 denotes methyl group or cyclohexyl group; n denotes an integer of 0 to 2; and each instance of X independently denotes a group denoted by any one of formulas (b) to (d) below:
in formulas (b), and (d), R 23 denotes hydrogen atom or methyl group and * denotes a binding position.
16. The polymerizable compound according to claim 15 , wherein R 21 denotes methyl group.
17. The polymerizable compound according to claim 15 , wherein n denotes 0.
18. A polymerizable composition comprising the polymerizable compound according to claim 15 .
19. The polymerizable composition according to claim 18 , further comprising a photopolymerization initiator.
20. A polymerizable compound denoted by general formula (11):
in general formula (11), R 21 denotes hydrogen atom or methyl group; R 22 denotes methyl group or cyclohexyl group; n denotes an integer of 0 to 2; and each instance of X independently denotes a group denoted by formula (b) or (d) below.