IP Library › Granted Patent US 9,458,313
Granted Patent B2
US 9,458,313 · App. 14/764,555 · Granted Oct 4, 2016

Heat-resistant SAN resin, method for manufacturing same, and heat-resistant ABS resin composition comprising same

Inventors: Jae Bum Seo (Daejeon, KR); Chang Hun Han (Daejeon, KR); Dae Woo Lee (Daejeon, KR); Jung Tae Park (Daejeon, KR); Eun Jung Choi (Daejeon, KR); Byoung Il Kang (Daejeon, KR); Da Eun Sung (Daejeon, KR); Gyu Sun Kim (Daejeon, KR)
Assignee: LG CHEM, LTD.
C08L25/12C08F2/02C08F212/10C08L25/16C08L55/02
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Quick Facts
Patent No.
US 9,458,313
App. No.
14/764,555
Granted
Oct 4, 2016
Kind
B2
Abstract

Disclosed are a heat-resistant SAN resin, a method of preparing the same, and a heat-resistant ABS resin composition comprising the same. More particularly, a heat-resistant SAN resin comprising 60 to 75 wt % of α-methylstyrene, 25 to 35 wt % of a vinyl cyan compound, and 0 to 10 wt % of an aromatic vinyl compound (except for α-methylstyrene), the heat-resistant SAN resin having a degree of branching of 0.40 to 0.60, a molecular weight of 90,000 to 150,000 g/mol, and a glass transition temperature (Tg) of 124 to 140° C., a method of preparing the same, and a heat-resistant ABS resin composition comprising the same are disclosed.

Claims (24)

1. A method of preparing a heat-resistant styrene-acrylonitrile (SAN) resin, the method comprising:

polymerizing by adding 0.05 to 0.5 parts by weight of a multifunctional initiator to 100 parts by weight of a monomer mixture comprising 60 to 75 wt % of α-methylstyrene, 25 to 35 wt % of a vinyl cyan compound, and 0 to 10 wt % of an aromatic vinyl compound other than α-methylstyrene, and

removing by volatilizing unreacted monomers and a solvent under a pressure of 25 torr or less after the polymerization.

2. The method according to claim 1 , wherein the multifunctional initiator comprises 2 to 4 functional groups.

3. The method according to claim 2 , wherein the functional groups are peroxide groups.

4. The method according to claim 2 , wherein the multifunctional initiator is 2,2-bis(4,4-di-t-butylperoxy cyclohexyl) propane, 1,1-bis(t-butylperoxy) cyclohexane, and a mixture thereof.

5. The method according to claim 1 , wherein the polymerization is performed at 95 to 105° C.

6. The method according to claim 1 , wherein the polymerization is performed for 6 to 8 hours.

7. The method according to claim 1 , wherein the polymerization is continuous bulk polymerization.

8. The method according to claim 1 , wherein the removing is performed at 200 to 250° C.

9. A heat-resistant acrylonitrile butadiene styrene (ABS) resin composition comprising:

an ABS resin; and

a heat-resistant styrene-acrylonitrile (SAN) resin,

wherein the heat-resistant SAN resin has a degree of branching of 0.40 to 0.60, a molecular weight of 90,000 to 150,000 g/mol, and a glass transition temperature (Tg) of 124 to 140° C.,

wherein the heat-resistant SAN resin comprises 60 to 75 wt % of α-methylstyrene, 25 to 35 wt % of a vinyl cyan compound, and 0 to 10 wt % of an aromatic vinyl compound other than α-methylstyrene, and

wherein the heat-resistant SAN resin comprises 0.1 to 0.8 wt % of an oligomer.

10. The heat-resistant ABS resin composition according to claim 9 , wherein the heat-resistant ABS resin composition comprises 10 to 40 wt % of an ABS resin and 60 to 90 wt % of the heat-resistant SAN resin.

11. The heat-resistant ABS resin composition according to claim 9 , wherein the heat-resistant ABS resin composition comprises a hindered phenolic antioxidant, a phosphorous antioxidant, or a mixture thereof.

12. A heat-resistant ABS resin composition comprising:

an acrylonitrile butadiene styrene (ABS) resin; and

a heat-resistant styrene-acrylonitrile (SAN) resin,

wherein the heat-resistant SAN resin has a degree of branching of 0.40 to 0.60, a molecular weight of 90,000 to 150,000 g/mol, and a glass transition temperature (Tg) of 124 to 140° C.,

wherein the heat-resistant SAN resin comprises 60 to 75 wt % of α-methylstyrene, 25 to 35 wt % of a vinyl cyan compound, and 0 to 10 wt % of an aromatic vinyl compound other than α-methylstyrene, and

wherein the heat-resistant ABS resin composition comprises 10 to 40 wt % of an ABS resin and 60 to 90 wt % of the heat-resistant SAN resin.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 31, 2015
From: SEO, JAE BUM; HAN, CHANG HUN; LEE, DAE WOO; PARK, JUNG TAE; CHOI, EUN JUNG; KANG, BYOUNG IL; SUNG, DA EUN; KIM, GYU SUN
To: LG CHEM, LTD.
Reel/Frame 036232/0296 →
Priority Claims (2)
KR 10-2013-0076845 · Jul 2, 2013 · national
KR 10-2014-0017211 · Feb 14, 2014 · national
Continuity (1)
Related Publication 20160108224A1 · Apr 21, 2016