Lamination method and lamination system
To provide a lamination method and a lamination system capable of excellently laminating a film-type laminate without damage even though the semiconductor is a brittle lamination target such as a foil-type semiconductor or a semiconductor made of highly brittle material. In a lamination method for laminating a film-type laminate to a brittle lamination target by overlapping the brittle lamination target and the film-type laminate and heating and pressing the brittle lamination target and the film-type laminate, with respect to the brittle lamination target mounted on a mount member and carried into a lamination device, an elastic film member is expanded into a vacuum chamber of the lamination device from the above to press and laminate the brittle lamination target and the film-type laminate.
1. A lamination method for laminating an electrically insulating film-type laminate on a semiconductor wafer, the method comprising:
mounting a mount member having the semiconductor wafer and the film-type laminate layered thereon in a vacuum chamber of a lamination device; and
heating and pressing the semiconductor wafer and the film-type laminate in the vacuum chamber by expanding an elastic upper film member from above the film-type laminate using compressed air so as to sandwich the semiconductor wafer and the film-type laminate between the elastic upper film member and an elastic fixing film member,
wherein:
the mount member comprises a wafer ring having a rim shape and a dicing tape adhered to a lower surface of the wafer ring, the lower surface of the wafer ring being the surface that faces the elastic fixing film member and is opposite the elastic upper film member, and
a thickness of the wafer ring is larger than the sum of thicknesses of the semiconductor wafer and the film-type laminate,
the method further comprising:
carrying the mount member, on which the semiconductor wafer on the dicing tape adhered to the lower surface of the wafer ring and the film-type laminate on the semiconductor wafer are mounted, into or out of the lamination device by supporting the wafer ring of the mount member, so as to press a lower side of the semiconductor wafer via the dicing tape toward the elastic fixing film member, the lower side being the side facing the elastic fixing film member and opposite the elastic upper film member.
2. A lamination method for laminating an electrically insulating film-type laminate on a semiconductor wafer, the method comprising:
mounting a mount member having the semiconductor wafer and the film-type laminate layered thereon in a vacuum chamber of a lamination device;
heating and pressing the semiconductor wafer and the film-type laminate in the vacuum chamber by expanding an elastic upper film member from above the film-type laminate using compressed air so as to sandwich the semiconductor wafer and the film-type laminate between the elastic upper film member and an elastic fixing film member, and so as to press a lower side of the semiconductor wafer via a dicing tape toward the elastic fixing film member, the lower side being the side facing the elastic fixing film member and opposite the elastic upper film member,
wherein:
the mount member comprises a wafer ring having a rim shape and the dicing tape adhered to a lower surface of the wafer ring, the lower surface of the wafer ring being the surface that faces the elastic fixing film member and is opposite the elastic upper film member, and
a thickness of the wafer ring is larger than the sum of thicknesses of the semiconductor wafer and the film-type laminate,
the method further comprising:
carrying the mount member, on which the semiconductor wafer on the dicing tape adhered to the lower surface of the wafer ring and the film-type laminate on the semiconductor wafer are mounted, into or out of the lamination device by using a carrier film that is installed at the lower side and unwound from an unwinding roll and wound around a winding roll.
3. The lamination method according to claim 1 , wherein the dicing tape is adhered to the lower surface of the wafer ring so as to close an inside hole of the wafer ring.
4. The lamination method according to claim 2 , wherein the dicing tape is adhered to the lower surface of the wafer ring so as to close an inside hole of the wafer ring.